AMD Ryzen 9 6900HS vs Intel Xeon W-2265
Comparative analysis of AMD Ryzen 9 6900HS and Intel Xeon W-2265 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Peripherals, Advanced Technologies, Virtualization, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the AMD Ryzen 9 6900HS
- CPU is newer: launch date 2 year(s) 3 month(s) later
- Around 7% higher clock speed: 4.9 GHz vs 4.60 GHz
- Around 56% higher maximum core temperature: 95 °C vs 61°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 6 nm vs 14 nm
- 4.7x lower typical power consumption: 35 Watt vs 165 Watt
- Around 18% better performance in PassMark - Single thread mark: 3286 vs 2789
| Specifications (specs) | |
| Launch date | Jan 2022 vs 1 Oct 2019 |
| Maximum frequency | 4.9 GHz vs 4.60 GHz |
| Maximum core temperature | 95 °C vs 61°C |
| Manufacturing process technology | 6 nm vs 14 nm |
| Thermal Design Power (TDP) | 35 Watt vs 165 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 3286 vs 2789 |
Reasons to consider the Intel Xeon W-2265
- 4 more cores, run more applications at once: 12 vs 8
- 8 more threads: 24 vs 16
- 4.8x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 10% better performance in PassMark - CPU mark: 25987 vs 23585
| Specifications (specs) | |
| Number of cores | 12 vs 8 |
| Number of threads | 24 vs 16 |
| L2 cache | 19.25 MB vs 4 MB |
| Benchmarks | |
| PassMark - CPU mark | 25987 vs 23585 |
Compare benchmarks
CPU 1: AMD Ryzen 9 6900HS
CPU 2: Intel Xeon W-2265
| PassMark - Single thread mark |
|
|
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| PassMark - CPU mark |
|
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| Name | AMD Ryzen 9 6900HS | Intel Xeon W-2265 |
|---|---|---|
| PassMark - Single thread mark | 3286 | 2789 |
| PassMark - CPU mark | 23585 | 25987 |
| 3DMark Fire Strike - Physics Score | 6900 |
Compare specifications (specs)
| AMD Ryzen 9 6900HS | Intel Xeon W-2265 | |
|---|---|---|
Essentials |
||
| Architecture codename | Zen 3+ | Cascade Lake |
| Launch date | Jan 2022 | 1 Oct 2019 |
| Place in performance rating | 608 | 592 |
| Vertical segment | Mobile | Workstation |
| Launch price (MSRP) | $944 | |
| Processor Number | W-2265 | |
| Series | Intel Xeon W Processor | |
| Status | Launched | |
Performance |
||
| Base frequency | 3.3 GHz | 3.50 GHz |
| Die size | 208 mm² | |
| L1 cache | 512 KB | |
| L2 cache | 4 MB | 19.25 MB |
| L3 cache | 16 MB | |
| Manufacturing process technology | 6 nm | 14 nm |
| Maximum core temperature | 95 °C | 61°C |
| Maximum frequency | 4.9 GHz | 4.60 GHz |
| Number of cores | 8 | 12 |
| Number of threads | 16 | 24 |
| Unlocked | ||
| 64 bit support | ||
| Bus Speed | 8 GT/s | |
| Number of QPI Links | 0 | |
| Number of Ultra Path Interconnect (UPI) Links | 0 | |
Memory |
||
| ECC memory support | ||
| Max memory channels | 2 | 4 |
| Supported memory types | DDR5-4800 | DDR4-2933 |
| Maximum memory bandwidth | 93.85 GB/s | |
| Maximum memory size | 1 TB | |
Graphics |
||
| Graphics max frequency | 2400 MHz | |
Compatibility |
||
| Sockets supported | FP7 | FCLGA2066 |
| Thermal Design Power (TDP) | 35 Watt | 165 Watt |
| Max number of CPUs in a configuration | 1 | |
| Package Size | 45mm x 52.5mm | |
Peripherals |
||
| Max number of PCIe lanes | 20 | 48 |
| PCI Express revision | 4.0 | 3.0 |
| PCIe configurations | x4, x8, x16 | |
| Scalability | 1S Only | |
Advanced Technologies |
||
| AMD SenseMI | ||
| AMD StoreMI technology | ||
| Fused Multiply-Add 3 (FMA3) | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® Advanced Vector Extensions 2 (AVX2) | ||
| Intel® AES New Instructions | ||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512 | |
| Intel 64 | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Optane™ Memory Supported | ||
| Intel® Turbo Boost technology | ||
| Intel® Volume Management Device (VMD) | ||
| Number of AVX-512 FMA Units | 2 | |
| Physical Address Extensions (PAE) | 46-bit | |
| Speed Shift technology | ||
| Thermal Monitoring | ||
Virtualization |
||
| AMD Virtualization (AMD-V™) | ||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® Memory Protection Extensions (Intel® MPX) | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Secure Boot | ||
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