AMD Ryzen 9 6900HS vs Intel Core i7-6820EQ
Comparative analysis of AMD Ryzen 9 6900HS and Intel Core i7-6820EQ processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Peripherals, Advanced Technologies, Virtualization, Graphics interfaces, Graphics image quality, Graphics API support, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the AMD Ryzen 9 6900HS
- 4 more cores, run more applications at once: 8 vs 4
- 8 more threads: 16 vs 8
- Around 40% higher clock speed: 4.9 GHz vs 3.50 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 6 nm vs 14 nm
- Around 29% lower typical power consumption: 35 Watt vs 45 Watt
- Around 65% better performance in PassMark - Single thread mark: 3286 vs 1997
- 3.4x better performance in PassMark - CPU mark: 23585 vs 7001
| Specifications (specs) | |
| Number of cores | 8 vs 4 |
| Number of threads | 16 vs 8 |
| Maximum frequency | 4.9 GHz vs 3.50 GHz |
| Manufacturing process technology | 6 nm vs 14 nm |
| Thermal Design Power (TDP) | 35 Watt vs 45 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 3286 vs 1997 |
| PassMark - CPU mark | 23585 vs 7001 |
Reasons to consider the Intel Core i7-6820EQ
- Around 5% higher maximum core temperature: 100°C vs 95 °C
| Maximum core temperature | 100°C vs 95 °C |
Compare benchmarks
CPU 1: AMD Ryzen 9 6900HS
CPU 2: Intel Core i7-6820EQ
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | AMD Ryzen 9 6900HS | Intel Core i7-6820EQ |
|---|---|---|
| PassMark - Single thread mark | 3286 | 1997 |
| PassMark - CPU mark | 23585 | 7001 |
| 3DMark Fire Strike - Physics Score | 6900 | |
| Geekbench 4 - Single Core | 3667 | |
| Geekbench 4 - Multi-Core | 11731 |
Compare specifications (specs)
| AMD Ryzen 9 6900HS | Intel Core i7-6820EQ | |
|---|---|---|
Essentials |
||
| Architecture codename | Zen 3+ | Skylake |
| Launch date | Jan 2022 | Q4'15 |
| Place in performance rating | 608 | 606 |
| Vertical segment | Mobile | Embedded |
| Processor Number | i7-6820EQ | |
| Series | 6th Generation Intel® Core™ i7 Processors | |
| Status | Launched | |
Performance |
||
| Base frequency | 3.3 GHz | 2.80 GHz |
| Die size | 208 mm² | |
| L1 cache | 512 KB | |
| L2 cache | 4 MB | |
| L3 cache | 16 MB | |
| Manufacturing process technology | 6 nm | 14 nm |
| Maximum core temperature | 95 °C | 100°C |
| Maximum frequency | 4.9 GHz | 3.50 GHz |
| Number of cores | 8 | 4 |
| Number of threads | 16 | 8 |
| Unlocked | ||
| 64 bit support | ||
| Bus Speed | 8 GT/s DMI3 | |
Memory |
||
| ECC memory support | ||
| Max memory channels | 2 | 2 |
| Supported memory types | DDR5-4800 | DDR4-2133, LPDDR3-1866, DDR3L-1600 |
| Maximum memory bandwidth | 34.1 GB/s | |
| Maximum memory size | 64 GB | |
Graphics |
||
| Graphics max frequency | 2400 MHz | |
| Device ID | 0x191B | |
| Graphics base frequency | 350 MHz | |
| Graphics max dynamic frequency | 1.00 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Max video memory | 64 GB | |
| Processor graphics | Intel® HD Graphics 530 | |
Compatibility |
||
| Sockets supported | FP7 | FCBGA1440 |
| Thermal Design Power (TDP) | 35 Watt | 45 Watt |
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | |
| Package Size | 42mm x 28mm | |
Peripherals |
||
| Max number of PCIe lanes | 20 | 16 |
| PCI Express revision | 4.0 | 3.0 |
| PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
Advanced Technologies |
||
| AMD SenseMI | ||
| AMD StoreMI technology | ||
| Fused Multiply-Add 3 (FMA3) | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® Advanced Vector Extensions 2 (AVX2) | ||
| Intel® AES New Instructions | ||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
| Intel 64 | ||
| Intel® Hyper-Threading technology | ||
| Intel® TSX-NI | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
Virtualization |
||
| AMD Virtualization (AMD-V™) | ||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
Graphics interfaces |
||
| DisplayPort | ||
| DVI | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 3 | |
Graphics image quality |
||
| 4K resolution support | ||
| Max resolution over DisplayPort | 4096x2304@60Hz | |
| Max resolution over eDP | 4096x2304@60Hz | |
| Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
Graphics API support |
||
| DirectX | 12 | |
| OpenGL | 4.5 | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® Memory Protection Extensions (Intel® MPX) | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Secure Boot | ||
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