AMD Ryzen Embedded R1600 vs Intel Core i7-4770TE
Comparative analysis of AMD Ryzen Embedded R1600 and Intel Core i7-4770TE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD Ryzen Embedded R1600
- CPU is newer: launch date 6 year(s) 8 month(s) later
- Around 47% higher maximum core temperature: 105 °C vs 71.45°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
- 3x lower typical power consumption: 15 Watt vs 45 Watt
- Around 2% better performance in PassMark - Single thread mark: 1724 vs 1688
Specifications (specs) | |
Launch date | 25 Feb 2020 vs June 2013 |
Maximum core temperature | 105 °C vs 71.45°C |
Manufacturing process technology | 14 nm vs 22 nm |
Thermal Design Power (TDP) | 15 Watt vs 45 Watt |
Benchmarks | |
PassMark - Single thread mark | 1724 vs 1688 |
Reasons to consider the Intel Core i7-4770TE
- 2 more cores, run more applications at once: 4 vs 2
- 4 more threads: 8 vs 4
- Around 6% higher clock speed: 3.30 GHz vs 3.1 GHz
- Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
- 2x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 52% better performance in PassMark - CPU mark: 4983 vs 3276
Specifications (specs) | |
Number of cores | 4 vs 2 |
Number of threads | 8 vs 4 |
Maximum frequency | 3.30 GHz vs 3.1 GHz |
L1 cache | 64 KB (per core) vs 192 KB |
L3 cache | 8192 KB (shared) vs 4 MB |
Benchmarks | |
PassMark - CPU mark | 4983 vs 3276 |
Compare benchmarks
CPU 1: AMD Ryzen Embedded R1600
CPU 2: Intel Core i7-4770TE
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Ryzen Embedded R1600 | Intel Core i7-4770TE |
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PassMark - Single thread mark | 1724 | 1688 |
PassMark - CPU mark | 3276 | 4983 |
Compare specifications (specs)
AMD Ryzen Embedded R1600 | Intel Core i7-4770TE | |
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Essentials |
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Architecture codename | Zen | Haswell |
Launch date | 25 Feb 2020 | June 2013 |
Place in performance rating | 1496 | 1489 |
Vertical segment | Mobile | Embedded |
Processor Number | i7-4770TE | |
Series | 4th Generation Intel® Core™ i7 Processors | |
Status | Launched | |
Performance |
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Base frequency | 2.6 GHz | 2.30 GHz |
Die size | 209.8 mm² | 177 mm |
L1 cache | 192 KB | 64 KB (per core) |
L2 cache | 1 MB | 256 KB (per core) |
L3 cache | 4 MB | 8192 KB (shared) |
Manufacturing process technology | 14 nm | 22 nm |
Maximum core temperature | 105 °C | 71.45°C |
Maximum frequency | 3.1 GHz | 3.30 GHz |
Number of cores | 2 | 4 |
Number of threads | 4 | 8 |
Transistor count | 4950 million | 1400 million |
Unlocked | ||
64 bit support | ||
Bus Speed | 5 GT/s DMI | |
Maximum case temperature (TCase) | 71 °C | |
Memory |
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ECC memory support | ||
Max memory channels | 2 | 2 |
Supported memory types | DDR4-2400 | DDR3 1333/1600 |
Maximum memory bandwidth | 25.6 GB/s | |
Maximum memory size | 32 GB | |
Compatibility |
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Configurable TDP-down | 12 Watt | |
Configurable TDP-up | 25 Watt | |
Max number of CPUs in a configuration | 1 | 1 |
Socket Count | FP5 | |
Thermal Design Power (TDP) | 15 Watt | 45 Watt |
Low Halogen Options Available | ||
Package Size | 37.5mm x 37.5mm (LGA1150) | |
Sockets supported | FCLGA1150 | |
Thermal Solution | PCG 2013B | |
Peripherals |
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Max number of PCIe lanes | 8 | 16 |
PCI Express revision | 3.0 | 3.0 |
PCIe configurations | 1x16 | |
Scalability | 1S Only | |
Graphics |
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Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 1.00 GHz | |
Graphics max frequency | 1 GHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 2 GB | |
Processor graphics | Intel® HD Graphics 4600 | |
Graphics interfaces |
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DisplayPort | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | |
VGA | ||
Wireless Display (WiDi) support | ||
Graphics image quality |
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Max resolution over HDMI 1.4 | N / A | |
Graphics API support |
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DirectX | 11.2/12 | |
OpenGL | 4.3 | |
Security & Reliability |
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Anti-Theft technology | ||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |