AMD Ryzen Embedded R1600 vs Intel Xeon E5-2628 v3

Comparative analysis of AMD Ryzen Embedded R1600 and Intel Xeon E5-2628 v3 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD Ryzen Embedded R1600

Intel Xeon E5-2628 v3

Differences

Reasons to consider the AMD Ryzen Embedded R1600

Around 3% higher clock speed: 3.1 GHz vs 3.00 GHz
Around 21% higher maximum core temperature: 105 °C vs 87.025°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
5.7x lower typical power consumption: 15 Watt vs 85 Watt

Maximum frequency	3.1 GHz vs 3.00 GHz
Maximum core temperature	105 °C vs 87.025°C
Manufacturing process technology	14 nm vs 22 nm
Thermal Design Power (TDP)	15 Watt vs 85 Watt

Reasons to consider the Intel Xeon E5-2628 v3

6 more cores, run more applications at once: 8 vs 2
4 more threads: 8 vs 4
Around 2% better performance in PassMark - Single thread mark: 1754 vs 1724
2.6x better performance in PassMark - CPU mark: 8447 vs 3276

Specifications (specs)
Number of cores	8 vs 2
Number of threads	8 vs 4
Max number of CPUs in a configuration	2 vs 1
Benchmarks
PassMark - Single thread mark	1754 vs 1724
PassMark - CPU mark	8447 vs 3276

Compare benchmarks

CPU 1: AMD Ryzen Embedded R1600
CPU 2: Intel Xeon E5-2628 v3

PassMark - Single thread mark

CPU 1

CPU 2

1724

1754

PassMark - CPU mark

CPU 1

CPU 2

3276

8447

Name	AMD Ryzen Embedded R1600	Intel Xeon E5-2628 v3
PassMark - Single thread mark	1724	1754
PassMark - CPU mark	3276	8447

Compare specifications (specs)

	AMD Ryzen Embedded R1600	Intel Xeon E5-2628 v3
Essentials
Architecture codename	Zen	Haswell
Launch date	25 Feb 2020	Q3'14
Place in performance rating	1496	1348
Vertical segment	Mobile	Embedded
Processor Number		E5-2628 V3
Series		Intel® Xeon® Processor E5 v3 Family
Status		Launched
Performance
Base frequency	2.6 GHz	2.50 GHz
Die size	209.8 mm²
L1 cache	192 KB
L2 cache	1 MB
L3 cache	4 MB
Manufacturing process technology	14 nm	22 nm
Maximum core temperature	105 °C	87.025°C
Maximum frequency	3.1 GHz	3.00 GHz
Number of cores	2	8
Number of threads	4	8
Transistor count	4950 million
Unlocked
64 bit support
Bus Speed		8 GT/s QPI
Number of QPI Links		2
VID voltage range		0.65V–1.30V
Memory
ECC memory support
Max memory channels	2	4
Supported memory types	DDR4-2400	DDR4-2133
Maximum memory bandwidth		68.3 GB/s
Maximum memory size		768 GB
Compatibility
Configurable TDP-down	12 Watt
Configurable TDP-up	25 Watt
Max number of CPUs in a configuration	1	2
Socket Count	FP5
Thermal Design Power (TDP)	15 Watt	85 Watt
Low Halogen Options Available
Package Size		52.5mm x 45mm
Sockets supported		FCLGA2011-3
Peripherals
Max number of PCIe lanes	8	40
PCI Express revision	3.0	3.0
PCIe configurations		x4, x8, x16
Scalability		2S
Security & Reliability
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions		Intel® AVX2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE)		46-bit
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)