AMD Ryzen Embedded R1600 vs Intel Xeon E5-2628 v3

Comparative analysis of AMD Ryzen Embedded R1600 and Intel Xeon E5-2628 v3 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD Ryzen Embedded R1600

  • Around 3% higher clock speed: 3.1 GHz vs 3.00 GHz
  • Around 21% higher maximum core temperature: 105 °C vs 87.025°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
  • 5.7x lower typical power consumption: 15 Watt vs 85 Watt
  • Around 1% better performance in PassMark - Single thread mark: 1779 vs 1754
Specifications (specs)
Maximum frequency 3.1 GHz vs 3.00 GHz
Maximum core temperature 105 °C vs 87.025°C
Manufacturing process technology 14 nm vs 22 nm
Thermal Design Power (TDP) 15 Watt vs 85 Watt
Benchmarks
PassMark - Single thread mark 1779 vs 1754

Reasons to consider the Intel Xeon E5-2628 v3

  • 6 more cores, run more applications at once: 8 vs 2
  • 4 more threads: 8 vs 4
  • 2.5x better performance in PassMark - CPU mark: 8447 vs 3365
Specifications (specs)
Number of cores 8 vs 2
Number of threads 8 vs 4
Max number of CPUs in a configuration 2 vs 1
Benchmarks
PassMark - CPU mark 8447 vs 3365

Compare benchmarks

CPU 1: AMD Ryzen Embedded R1600
CPU 2: Intel Xeon E5-2628 v3

PassMark - Single thread mark
CPU 1
CPU 2
1779
1754
PassMark - CPU mark
CPU 1
CPU 2
3365
8447
Name AMD Ryzen Embedded R1600 Intel Xeon E5-2628 v3
PassMark - Single thread mark 1779 1754
PassMark - CPU mark 3365 8447

Compare specifications (specs)

AMD Ryzen Embedded R1600 Intel Xeon E5-2628 v3

Essentials

Architecture codename Zen Haswell
Launch date 25 Feb 2020 Q3'14
Place in performance rating 1365 1256
Vertical segment Mobile Embedded
Processor Number E5-2628 V3
Series Intel® Xeon® Processor E5 v3 Family
Status Launched

Performance

Base frequency 2.6 GHz 2.50 GHz
Die size 209.8 mm²
L1 cache 192 KB
L2 cache 1 MB
L3 cache 4 MB
Manufacturing process technology 14 nm 22 nm
Maximum core temperature 105 °C 87.025°C
Maximum frequency 3.1 GHz 3.00 GHz
Number of cores 2 8
Number of threads 4 8
Transistor count 4950 million
Unlocked
64 bit support
Bus Speed 8 GT/s QPI
Number of QPI Links 2
VID voltage range 0.65V–1.30V

Memory

ECC memory support
Max memory channels 2 4
Supported memory types DDR4-2400 DDR4-2133
Maximum memory bandwidth 68.3 GB/s
Maximum memory size 768 GB

Compatibility

Configurable TDP-down 12 Watt
Configurable TDP-up 25 Watt
Max number of CPUs in a configuration 1 2
Socket Count FP5
Thermal Design Power (TDP) 15 Watt 85 Watt
Low Halogen Options Available
Package Size 52.5mm x 45mm
Sockets supported FCLGA2011-3

Peripherals

Max number of PCIe lanes 8 40
PCI Express revision 3.0 3.0
PCIe configurations x4, x8, x16
Scalability 2S

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® AVX2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE) 46-bit
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)