AMD Ryzen Z1 vs AMD Ryzen 9 7940HS
Comparative analysis of AMD Ryzen Z1 and AMD Ryzen 9 7940HS processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the AMD Ryzen Z1
- CPU is newer: launch date 3 month(s) later
- 2.3x lower typical power consumption: 15 Watt vs 35 Watt
Launch date | May 2023 vs Jan 2023 |
Thermal Design Power (TDP) | 15 Watt vs 35 Watt |
Reasons to consider the AMD Ryzen 9 7940HS
- 2 more cores, run more applications at once: 8 vs 6
- 4 more threads: 16 vs 12
- Around 6% higher clock speed: 5.2 GHz vs 4.9 GHz
- Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
- Around 33% more L2 cache; more data can be stored in the L2 cache for quick access later
- Around 4% better performance in PassMark - Single thread mark: 3902 vs 3735
- Around 62% better performance in PassMark - CPU mark: 30380 vs 18778
Specifications (specs) | |
Number of cores | 8 vs 6 |
Number of threads | 16 vs 12 |
Maximum frequency | 5.2 GHz vs 4.9 GHz |
L1 cache | 64K (per core) vs 64K (per core) |
L2 cache | 1MB (per core) vs 1MB (per core) |
Benchmarks | |
PassMark - Single thread mark | 3902 vs 3735 |
PassMark - CPU mark | 30380 vs 18778 |
Compare benchmarks
CPU 1: AMD Ryzen Z1
CPU 2: AMD Ryzen 9 7940HS
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Ryzen Z1 | AMD Ryzen 9 7940HS |
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PassMark - Single thread mark | 3735 | 3902 |
PassMark - CPU mark | 18778 | 30380 |
3DMark Fire Strike - Physics Score | 7717 |
Compare specifications (specs)
AMD Ryzen Z1 | AMD Ryzen 9 7940HS | |
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Essentials |
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Launch date | May 2023 | Jan 2023 |
Place in performance rating | 308 | 341 |
Performance |
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Base frequency | 3.2 GHz | 4 GHz |
L1 cache | 64K (per core) | 64K (per core) |
L2 cache | 1MB (per core) | 1MB (per core) |
L3 cache | 16MB (shared) | 16MB (shared) |
Manufacturing process technology | 4 nm | 4 nm |
Maximum core temperature | 100°C | 100°C |
Maximum frequency | 4.9 GHz | 5.2 GHz |
Number of cores | 6 | 8 |
Number of threads | 12 | 16 |
Unlocked | ||
Die size | 178 mm² | |
Transistor count | 25,000 million | |
Memory |
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ECC memory support | ||
Supported memory types | DDR5-5600 MHz, Dual-channel | DDR5-5600 MHz, Dual-channel |
Compatibility |
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Configurable TDP | 9-30 Watt | 54 Watt |
Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | FP8 | FP8 |
Thermal Design Power (TDP) | 15 Watt | 35 Watt |
Peripherals |
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PCIe configurations | Gen 4, 20 Lanes, (CPU only) | Gen 4, 20 Lanes, (CPU only) |