AMD Sempron 2800+ vs Intel Celeron D 326

Comparative analysis of AMD Sempron 2800+ and Intel Celeron D 326 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Memory, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD Sempron 2800+

Intel Celeron D 326

Differences

Reasons to consider the AMD Sempron 2800+

CPU is newer: launch date 1 year(s) 7 month(s) later
Around 3% higher maximum core temperature: 70°C vs 67.7°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
8x more L1 cache, more data can be stored in the L1 cache for quick access later
Around 87% lower typical power consumption: 45 Watt vs 84 Watt

Launch date	May 2006 vs September 2004
Maximum core temperature	70°C vs 67.7°C
Manufacturing process technology	65 nm vs 90 nm
L1 cache	128 KB vs 16 KB
Thermal Design Power (TDP)	45 Watt vs 84 Watt

Reasons to consider the Intel Celeron D 326

Around 58% higher clock speed: 2.53 GHz vs 1.6 GHz
2x more L2 cache, more data can be stored in the L2 cache for quick access later

Maximum frequency	2.53 GHz vs 1.6 GHz
L2 cache	256 KB vs 128 KB

Compare benchmarks

CPU 1: AMD Sempron 2800+
CPU 2: Intel Celeron D 326

Name	AMD Sempron 2800+	Intel Celeron D 326
PassMark - Single thread mark	408
PassMark - CPU mark	243

Compare specifications (specs)

	AMD Sempron 2800+	Intel Celeron D 326
Essentials
Architecture codename	Manila	Prescott
Family	AMD Sempron
Launch date	May 2006	September 2004
Launch price (MSRP)	$104
OPN Tray	AXDA2800DKV4D
Place in performance rating	3142	not rated
Price now	$19.99
Series	AMD Sempron	Legacy Intel® Celeron® Processor
Value for money (0-100)	5.65
Vertical segment	Desktop	Desktop
Processor Number		326
Status		Discontinued
Performance
64 bit support
Base frequency	56 MHz	2.53 GHz
Die size	103 mm	112 mm2
L1 cache	128 KB	16 KB
L2 cache	128 KB	256 KB
Manufacturing process technology	65 nm	90 nm
Maximum core temperature	70°C	67.7°C
Maximum frequency	1.6 GHz	2.53 GHz
Number of cores	1	1
Transistor count	81 million	125 million
Unlocked
Bus Speed		533 MHz FSB
VID voltage range		1.250V-1.400V
Compatibility
Max number of CPUs in a configuration	1	1
Sockets supported	939	PLGA775, PLGA478
Thermal Design Power (TDP)	45 Watt	84 Watt
Low Halogen Options Available
Package Size		37.5mm x 37.5mm
Memory
Supported memory types		DDR1, DDR2, DDR3
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE)		32-bit
Virtualization
Intel® Virtualization Technology (VT-x)