AMD Turion II Neo K625 vs Intel Mobile Pentium 4 3.06

Comparative analysis of AMD Turion II Neo K625 and Intel Mobile Pentium 4 3.06 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Memory, Advanced Technologies. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD Turion II Neo K625

  • CPU is newer: launch date 6 year(s) 11 month(s) later
  • 1 more cores, run more applications at once: 2 vs 1
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 130 nm
  • 2x more L2 cache, more data can be stored in the L2 cache for quick access later
  • 4.7x lower typical power consumption: 15 Watt vs 70 Watt
  • Around 78% better performance in PassMark - CPU mark: 618 vs 347
Specifications (specs)
Launch date 12 May 2010 vs June 2003
Number of cores 2 vs 1
Manufacturing process technology 45 nm vs 130 nm
L2 cache 1024 KB vs 512 KB
Thermal Design Power (TDP) 15 Watt vs 70 Watt
Benchmarks
PassMark - CPU mark 618 vs 347

Reasons to consider the Intel Mobile Pentium 4 3.06

  • Around 105% higher clock speed: 3.07 GHz vs 1.5 GHz
  • Around 4% better performance in PassMark - Single thread mark: 657 vs 631
Specifications (specs)
Maximum frequency 3.07 GHz vs 1.5 GHz
Benchmarks
PassMark - Single thread mark 657 vs 631

Compare benchmarks

CPU 1: AMD Turion II Neo K625
CPU 2: Intel Mobile Pentium 4 3.06

PassMark - Single thread mark
CPU 1
CPU 2
631
657
PassMark - CPU mark
CPU 1
CPU 2
618
347
Name AMD Turion II Neo K625 Intel Mobile Pentium 4 3.06
PassMark - Single thread mark 631 657
PassMark - CPU mark 618 347

Compare specifications (specs)

AMD Turion II Neo K625 Intel Mobile Pentium 4 3.06

Essentials

Architecture codename Geneva Northwood
Launch date 12 May 2010 June 2003
Place in performance rating 2790 2772
Series AMD Turion II Neo
Vertical segment Laptop Laptop

Performance

64 bit support
Front-side bus (FSB) 3200 MHz
L2 cache 1024 KB 512 KB
Manufacturing process technology 45 nm 130 nm
Maximum frequency 1.5 GHz 3.07 GHz
Number of cores 2 1
Number of threads 2
Die size 131 mm
L1 cache 8 KB
Maximum case temperature (TCase) 74 °C
Transistor count 55 million

Compatibility

Sockets supported S1 478
Thermal Design Power (TDP) 15 Watt 70 Watt
Max number of CPUs in a configuration 1

Memory

Supported memory types DDR1, DDR2

Advanced Technologies

Intel® Hyper-Threading technology