AMD Turion II Neo K625 vs Intel Mobile Pentium 4 3.06
Comparative analysis of AMD Turion II Neo K625 and Intel Mobile Pentium 4 3.06 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Memory, Advanced Technologies. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD Turion II Neo K625
- CPU is newer: launch date 6 year(s) 11 month(s) later
- 1 more cores, run more applications at once: 2 vs 1
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 130 nm
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- 4.7x lower typical power consumption: 15 Watt vs 70 Watt
- Around 78% better performance in PassMark - CPU mark: 618 vs 347
Specifications (specs) | |
Launch date | 12 May 2010 vs June 2003 |
Number of cores | 2 vs 1 |
Manufacturing process technology | 45 nm vs 130 nm |
L2 cache | 1024 KB vs 512 KB |
Thermal Design Power (TDP) | 15 Watt vs 70 Watt |
Benchmarks | |
PassMark - CPU mark | 618 vs 347 |
Reasons to consider the Intel Mobile Pentium 4 3.06
- Around 105% higher clock speed: 3.07 GHz vs 1.5 GHz
- Around 4% better performance in PassMark - Single thread mark: 657 vs 631
Specifications (specs) | |
Maximum frequency | 3.07 GHz vs 1.5 GHz |
Benchmarks | |
PassMark - Single thread mark | 657 vs 631 |
Compare benchmarks
CPU 1: AMD Turion II Neo K625
CPU 2: Intel Mobile Pentium 4 3.06
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Turion II Neo K625 | Intel Mobile Pentium 4 3.06 |
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PassMark - Single thread mark | 631 | 657 |
PassMark - CPU mark | 618 | 347 |
Compare specifications (specs)
AMD Turion II Neo K625 | Intel Mobile Pentium 4 3.06 | |
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Essentials |
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Architecture codename | Geneva | Northwood |
Launch date | 12 May 2010 | June 2003 |
Place in performance rating | 2791 | 2771 |
Series | AMD Turion II Neo | |
Vertical segment | Laptop | Laptop |
Performance |
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64 bit support | ||
Front-side bus (FSB) | 3200 MHz | |
L2 cache | 1024 KB | 512 KB |
Manufacturing process technology | 45 nm | 130 nm |
Maximum frequency | 1.5 GHz | 3.07 GHz |
Number of cores | 2 | 1 |
Number of threads | 2 | |
Die size | 131 mm | |
L1 cache | 8 KB | |
Maximum case temperature (TCase) | 74 °C | |
Transistor count | 55 million | |
Compatibility |
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Sockets supported | S1 | 478 |
Thermal Design Power (TDP) | 15 Watt | 70 Watt |
Max number of CPUs in a configuration | 1 | |
Memory |
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Supported memory types | DDR1, DDR2 | |
Advanced Technologies |
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Intel® Hyper-Threading technology |