Apple A17 Pro vs AMD Ryzen 7 7745HX

Comparative analysis of Apple A17 Pro and AMD Ryzen 7 7745HX processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the Apple A17 Pro

  • CPU is newer: launch date 7 month(s) later
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 3 nm vs 5 nm
  • 2097152x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 14% better performance in PassMark - Single thread mark: 4533 vs 3959
Specifications (specs)
Launch date Sep 2023 vs 4 Jan 2023
Manufacturing process technology 3 nm vs 5 nm
L2 cache 16 MB vs 1MB (per core)
Benchmarks
PassMark - Single thread mark 4533 vs 3959

Reasons to consider the AMD Ryzen 7 7745HX

  • Processor is unlocked, an unlocked multiplier allows for easier overclocking
  • 2 more cores, run more applications at once: 8 vs 6
  • 10 more threads: 16 vs 6
  • Around 35% higher clock speed: 5.1 GHz vs 3.78 GHz
  • 2x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 2.7x better performance in PassMark - CPU mark: 32838 vs 12263
Specifications (specs)
Unlocked Unlocked vs Locked
Number of cores 8 vs 6
Number of threads 16 vs 6
Maximum frequency 5.1 GHz vs 3.78 GHz
L1 cache 64K (per core) vs 256 KB
Benchmarks
PassMark - CPU mark 32838 vs 12263

Compare benchmarks

CPU 1: Apple A17 Pro
CPU 2: AMD Ryzen 7 7745HX

PassMark - Single thread mark
CPU 1
CPU 2
4533
3959
PassMark - CPU mark
CPU 1
CPU 2
12263
32838
Name Apple A17 Pro AMD Ryzen 7 7745HX
PassMark - Single thread mark 4533 3959
PassMark - CPU mark 12263 32838

Compare specifications (specs)

Apple A17 Pro AMD Ryzen 7 7745HX

Essentials

Launch date Sep 2023 4 Jan 2023
Place in performance rating 131 123
Processor Number APL1V02
Vertical segment Mobile
Architecture codename Zen 4 (Dragon Range)

Performance

Base frequency 2.02 GHz 3.6 GHz
L1 cache 256 KB 64K (per core)
L2 cache 16 MB 1MB (per core)
Manufacturing process technology 3 nm 5 nm
Maximum frequency 3.78 GHz 5.1 GHz
Number of cores 6 8
Number of threads 6 16
Transistor count 19 billion 6,570 million
Die size 71 mm²
L3 cache 32MB (shared)
Maximum core temperature 100°C
Unlocked

Memory

Max memory channels 1
Maximum memory bandwidth 51.2 GB/s
Maximum memory size 6 GB
Supported memory types LPDDR5-6400 DDR5-5200 MHz, Dual-channel
ECC memory support

Graphics

Execution Units 20
Graphics base frequency 1398 MHz
iGPU core count 6

Compatibility

Configurable TDP 45-75 Watt
Max number of CPUs in a configuration 1
Sockets supported FL1
Thermal Design Power (TDP) 55 Watt

Peripherals

PCIe configurations Gen 5, 28 Lanes, (CPU only)