AMD Ryzen 9 8945HS vs Apple A17 Pro

Comparative analysis of AMD Ryzen 9 8945HS and Apple A17 Pro processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD Ryzen 9 8945HS

Apple A17 Pro

Differences

Reasons to consider the AMD Ryzen 9 8945HS

CPU is newer: launch date 3 month(s) later
2 more cores, run more applications at once: 8 vs 6
10 more threads: 16 vs 6
Around 38% higher clock speed: 5.2 GHz vs 3.78 GHz
2x more L1 cache, more data can be stored in the L1 cache for quick access later
2.4x better performance in PassMark - CPU mark: 29414 vs 12257

Specifications (specs)
Launch date	6 Dec 2023 vs Sep 2023
Number of cores	8 vs 6
Number of threads	16 vs 6
Maximum frequency	5.2 GHz vs 3.78 GHz
L1 cache	64 KB (per core) vs 256 KB
Benchmarks
PassMark - CPU mark	29414 vs 12257

Reasons to consider the Apple A17 Pro

A newer manufacturing process allows for a more powerful, yet cooler running processor: 3 nm vs 4 nm
2x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 17% better performance in PassMark - Single thread mark: 4539 vs 3863

Specifications (specs)
Manufacturing process technology	3 nm vs 4 nm
L2 cache	16 MB vs 1 MB (per core)
Benchmarks
PassMark - Single thread mark	4539 vs 3863

Compare benchmarks

CPU 1: AMD Ryzen 9 8945HS
CPU 2: Apple A17 Pro

PassMark - Single thread mark

CPU 1

CPU 2

3863

4539

PassMark - CPU mark

CPU 1

CPU 2

29414

12257

Name	AMD Ryzen 9 8945HS	Apple A17 Pro
PassMark - Single thread mark	3863	4539
PassMark - CPU mark	29414	12257

Compare specifications (specs)

	AMD Ryzen 9 8945HS	Apple A17 Pro
Essentials
Launch date	6 Dec 2023	Sep 2023
Place in performance rating	179	156
Processor Number		APL1V02
Vertical segment		Mobile
Performance
Base frequency	4 GHz	2.02 GHz
Die size	178 mm²
L1 cache	64 KB (per core)	256 KB
L2 cache	1 MB (per core)	16 MB
L3 cache	16 MB (shared)
Manufacturing process technology	4 nm	3 nm
Maximum core temperature	100°C
Maximum frequency	5.2 GHz	3.78 GHz
Number of cores	8	6
Number of threads	16	6
Transistor count	25,000 million	19 billion
Unlocked
Memory
ECC memory support
Supported memory types	DDR5	LPDDR5-6400
Max memory channels		1
Maximum memory bandwidth		51.2 GB/s
Maximum memory size		6 GB
Compatibility
Configurable TDP	35-54 Watt
Max number of CPUs in a configuration	1
Sockets supported	FP8
Thermal Design Power (TDP)	45 Watt
Peripherals
PCIe configurations	Gen 4, 20 Lanes, (CPU only)
Graphics
Execution Units		20
Graphics base frequency		1398 MHz
iGPU core count		6