Apple A17 Pro vs AMD Ryzen 9 7940H
Comparative analysis of Apple A17 Pro and AMD Ryzen 9 7940H processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Apple A17 Pro
- CPU is newer: launch date 8 month(s) later
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 3 nm vs 4 nm
- 2097152x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 15% better performance in PassMark - Single thread mark: 4537 vs 3956
Specifications (specs) | |
Launch date | Sep 2023 vs Jan 2023 |
Manufacturing process technology | 3 nm vs 4 nm |
L2 cache | 16 MB vs 1MB (per core) |
Benchmarks | |
PassMark - Single thread mark | 4537 vs 3956 |
Reasons to consider the AMD Ryzen 9 7940H
- 2 more cores, run more applications at once: 8 vs 6
- 10 more threads: 16 vs 6
- Around 38% higher clock speed: 5.2 GHz vs 3.78 GHz
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2.3x better performance in PassMark - CPU mark: 28660 vs 12254
Specifications (specs) | |
Number of cores | 8 vs 6 |
Number of threads | 16 vs 6 |
Maximum frequency | 5.2 GHz vs 3.78 GHz |
L1 cache | 64K (per core) vs 256 KB |
Benchmarks | |
PassMark - CPU mark | 28660 vs 12254 |
Compare benchmarks
CPU 1: Apple A17 Pro
CPU 2: AMD Ryzen 9 7940H
PassMark - Single thread mark |
|
|
||||
PassMark - CPU mark |
|
|
Name | Apple A17 Pro | AMD Ryzen 9 7940H |
---|---|---|
PassMark - Single thread mark | 4537 | 3956 |
PassMark - CPU mark | 12254 | 28660 |
Compare specifications (specs)
Apple A17 Pro | AMD Ryzen 9 7940H | |
---|---|---|
Essentials |
||
Launch date | Sep 2023 | Jan 2023 |
Place in performance rating | 168 | 181 |
Processor Number | APL1V02 | |
Vertical segment | Mobile | |
Performance |
||
Base frequency | 2.02 GHz | 4 GHz |
L1 cache | 256 KB | 64K (per core) |
L2 cache | 16 MB | 1MB (per core) |
Manufacturing process technology | 3 nm | 4 nm |
Maximum frequency | 3.78 GHz | 5.2 GHz |
Number of cores | 6 | 8 |
Number of threads | 6 | 16 |
Transistor count | 19 billion | 25,000 million |
Die size | 178 mm² | |
L3 cache | 16MB (shared) | |
Maximum core temperature | 100°C | |
Unlocked | ||
Memory |
||
Max memory channels | 1 | |
Maximum memory bandwidth | 51.2 GB/s | |
Maximum memory size | 6 GB | |
Supported memory types | LPDDR5-6400 | DDR5-5600 MHz, Dual-channel |
ECC memory support | ||
Graphics |
||
Execution Units | 20 | |
Graphics base frequency | 1398 MHz | |
iGPU core count | 6 | |
Compatibility |
||
Configurable TDP | 54 Watt | |
Max number of CPUs in a configuration | 1 | |
Sockets supported | FP8 | |
Thermal Design Power (TDP) | 35 Watt | |
Peripherals |
||
PCIe configurations | Gen 4, 20 Lanes, (CPU only) |