Intel Atom C2558 vs AMD Mobile Sempron 3300+

Comparative analysis of Intel Atom C2558 and AMD Mobile Sempron 3300+ processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the Intel Atom C2558

  • 3 more cores, run more applications at once: 4 vs 1
  • 3 more threads: 4 vs 1
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 90 nm
  • 4.1x lower typical power consumption: 15 Watt vs 62 / 25 Watt
  • 3.2x better performance in PassMark - CPU mark: 1424 vs 445
Specifications (specs)
Number of cores 4 vs 1
Number of threads 4 vs 1
Manufacturing process technology 22 nm vs 90 nm
Thermal Design Power (TDP) 15 Watt vs 62 / 25 Watt
Benchmarks
PassMark - CPU mark 1424 vs 445

Reasons to consider the AMD Mobile Sempron 3300+

  • Around 12% better performance in PassMark - Single thread mark: 574 vs 512
Benchmarks
PassMark - Single thread mark 574 vs 512

Compare benchmarks

CPU 1: Intel Atom C2558
CPU 2: AMD Mobile Sempron 3300+

PassMark - Single thread mark
CPU 1
CPU 2
512
574
PassMark - CPU mark
CPU 1
CPU 2
1424
445
Name Intel Atom C2558 AMD Mobile Sempron 3300+
PassMark - Single thread mark 512 574
PassMark - CPU mark 1424 445

Compare specifications (specs)

Intel Atom C2558 AMD Mobile Sempron 3300+

Essentials

Architecture codename Rangeley Roma
Launch date Q3'13 1 June 2005
Place in performance rating 2927 2896
Processor Number C2558
Series Intel® Atom™ Processor C Series AMD Mobile Sempron
Status Launched
Vertical segment Embedded Laptop

Performance

64 bit support
Base frequency 2.40 GHz
Manufacturing process technology 22 nm 90 nm
Number of cores 4 1
Number of threads 4 1
Front-side bus (FSB) 800 MHz
L2 cache 128 KB
Maximum frequency 2 GHz

Memory

Max memory channels 2
Maximum memory size 64 GB
Supported memory types DDR3/DDR3L 1600

Compatibility

Low Halogen Options Available
Package Size 34 mm x 28 mm
Sockets supported FCBGA1283 745
Thermal Design Power (TDP) 15 Watt 62 / 25 Watt

Peripherals

Integrated LAN
Max number of PCIe lanes 16
Max number of SATA 6 Gb/s Ports 2
Number of USB ports 4
PCI Express revision 2
PCIe configurations x1,x2,x4,x8,x16
Total number of SATA ports 6
UART
USB revision 2

Security & Reliability

Execute Disable Bit (EDB)

Advanced Technologies

Integrated Intel® QuickAssist Technology
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE) 36-bit

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® VT-x with Extended Page Tables (EPT)