Intel Atom S1260 vs AMD Opteron 2350 HE

Comparative analysis of Intel Atom S1260 and AMD Opteron 2350 HE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Atom S1260

AMD Opteron 2350 HE

Differences

Reasons to consider the Intel Atom S1260

CPU is newer: launch date 4 year(s) 2 month(s) later
A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
8.8x lower typical power consumption: 8.5 Watt vs 79 Watt

Launch date	December 2012 vs October 2008
Manufacturing process technology	32 nm vs 65 nm
Thermal Design Power (TDP)	8.5 Watt vs 79 Watt

Reasons to consider the AMD Opteron 2350 HE

2 more cores, run more applications at once: 4 vs 2
2.3x more L1 cache, more data can be stored in the L1 cache for quick access later
2x more L2 cache, more data can be stored in the L2 cache for quick access later
5.4x better performance in PassMark - CPU mark: 2820 vs 526

Specifications (specs)
Number of cores	4 vs 2
L1 cache	256 KB (shared) vs 56 KB (per core)
L2 cache	2048 KB (shared) vs 512 KB (per core)
Benchmarks
PassMark - CPU mark	2820 vs 526

Compare benchmarks

CPU 1: Intel Atom S1260
CPU 2: AMD Opteron 2350 HE

PassMark - CPU mark

CPU 1

CPU 2

526

2820

Name	Intel Atom S1260	AMD Opteron 2350 HE
PassMark - Single thread mark	313	0
PassMark - CPU mark	526	2820

Compare specifications (specs)

	Intel Atom S1260	AMD Opteron 2350 HE
Essentials
Architecture codename	Centerton	Barcelona
Launch date	December 2012	October 2008
Launch price (MSRP)	$64
Place in performance rating	3130	3235
Price now	$64
Processor Number	S1260
Series	Intel® Atom™ Processor S Series
Status	Discontinued
Value for money (0-100)	4.22
Vertical segment	Server	Server
Performance
64 bit support
Base frequency	2.00 GHz
L1 cache	56 KB (per core)	256 KB (shared)
L2 cache	512 KB (per core)	2048 KB (shared)
Manufacturing process technology	32 nm	65 nm
Maximum frequency	2 GHz	2 GHz
Number of cores	2	4
Number of threads	4
Die size		285 mm
L3 cache		2048 KB
Maximum case temperature (TCase)		76 °C
Transistor count		463 million
Memory
ECC memory support
Max memory channels	1
Maximum memory bandwidth	10.6 GB/s
Maximum memory size	8 GB
Supported memory types	DDR3 1333
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1
Sockets supported	FCBGA1283	Fr2
Thermal Design Power (TDP)	8.5 Watt	79 Watt
Peripherals
Max number of PCIe lanes	8
PCI Express revision	2.0
PCI support
UART
Advanced Technologies
Intel® Hyper-Threading technology
Virtualization
Intel® Virtualization Technology (VT-x)