Intel Celeron 2002E vs AMD Turion 64 X2 TL-64

Comparative analysis of Intel Celeron 2002E and AMD Turion 64 X2 TL-64 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Celeron 2002E

  • Around 5% higher maximum core temperature: 100°C vs 95°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 65 nm
  • Around 40% lower typical power consumption: 25 Watt vs 35 Watt
  • Around 24% better performance in PassMark - Single thread mark: 871 vs 702
  • Around 62% better performance in PassMark - CPU mark: 1091 vs 675
Specifications (specs)
Maximum core temperature 100°C vs 95°C
Manufacturing process technology 22 nm vs 65 nm
Thermal Design Power (TDP) 25 Watt vs 35 Watt
Benchmarks
PassMark - Single thread mark 871 vs 702
PassMark - CPU mark 1091 vs 675

Compare benchmarks

CPU 1: Intel Celeron 2002E
CPU 2: AMD Turion 64 X2 TL-64

PassMark - Single thread mark
CPU 1
CPU 2
871
702
PassMark - CPU mark
CPU 1
CPU 2
1091
675
Name Intel Celeron 2002E AMD Turion 64 X2 TL-64
PassMark - Single thread mark 871 702
PassMark - CPU mark 1091 675
Geekbench 4 - Single Core 1087
Geekbench 4 - Multi-Core 1806

Compare specifications (specs)

Intel Celeron 2002E AMD Turion 64 X2 TL-64

Essentials

Architecture codename Haswell Trinidad
Launch date Q1'14 13 April 2007
Place in performance rating 2447 2353
Processor Number 2002E
Series Intel® Celeron® Processor 2000 Series AMD Turion 64 X2 Dual-Core Mobile Technology
Status Launched
Vertical segment Embedded Laptop
Family AMD Turion
OPN Tray TMDTL64HAX5DM

Performance

64 bit support
Base frequency 1.50 GHz 2.2 GHz
Bus Speed 5 GT/s DMI2
Manufacturing process technology 22 nm 65 nm
Maximum core temperature 100°C 95°C
Number of cores 2 2
Number of threads 2 2
Die size 147 mm
Front-side bus (FSB) 800 MHz
L1 cache 256 KB
L2 cache 1 MB
Maximum frequency 2.2 GHz
Transistor count 154 Million
Unlocked

Memory

Max memory channels 2
Maximum memory bandwidth 25.6 GB/s
Maximum memory size 32 GB
Supported memory types DDR3L 1333/1600 DDR2
Supported memory frequency 667 MHz

Graphics

Graphics base frequency 400 MHz
Graphics max dynamic frequency 900 MHz
Intel® Flexible Display Interface (Intel® FDI)
Max video memory 1 GB
Processor graphics Intel HD Graphics

Graphics interfaces

DisplayPort
eDP
HDMI
Number of displays supported 3
VGA

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1
Package Size 37.5mm x 32mm x 1.6mm
Sockets supported FCBGA1364 S1
Thermal Design Power (TDP) 25 Watt 35 Watt

Peripherals

Max number of PCIe lanes 16
PCI Express revision 3.0
PCIe configurations 1x16 or 2x8 or 1x8 2x4
Scalability 1S Only

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)