Intel Celeron 3765U vs Intel Celeron M 575
Comparative analysis of Intel Celeron 3765U and Intel Celeron M 575 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the Intel Celeron 3765U
- CPU is newer: launch date 7 year(s) 0 month(s) later
- 1 more cores, run more applications at once: 2 vs 1
- 1 more threads: 2 vs 1
- Around 5% higher maximum core temperature: 105°C vs 100°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 65 nm
- 2.1x lower typical power consumption: 15 Watt vs 31 Watt
Launch date | 1 June 2015 vs 1 June 2008 |
Number of cores | 2 vs 1 |
Number of threads | 2 vs 1 |
Maximum core temperature | 105°C vs 100°C |
Manufacturing process technology | 14 nm vs 65 nm |
Thermal Design Power (TDP) | 15 Watt vs 31 Watt |
Reasons to consider the Intel Celeron M 575
- Around 5% higher clock speed: 2 GHz vs 1.9 GHz
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
Maximum frequency | 2 GHz vs 1.9 GHz |
L2 cache | 1 MB vs 512 KB |
Compare benchmarks
CPU 1: Intel Celeron 3765U
CPU 2: Intel Celeron M 575
Name | Intel Celeron 3765U | Intel Celeron M 575 |
---|---|---|
PassMark - Single thread mark | 1171 | |
PassMark - CPU mark | 1252 | |
GFXBench 4.0 - Car Chase Offscreen (Frames) | 691 | |
GFXBench 4.0 - Car Chase Offscreen (Fps) | 691 | |
GFXBench 4.0 - Manhattan (Frames) | 1225 | |
GFXBench 4.0 - Manhattan (Fps) | 1225 | |
GFXBench 4.0 - T-Rex (Frames) | 2168 | |
GFXBench 4.0 - T-Rex (Fps) | 2168 |
Compare specifications (specs)
Intel Celeron 3765U | Intel Celeron M 575 | |
---|---|---|
Essentials |
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Architecture codename | Broadwell | Merom |
Launch date | 1 June 2015 | 1 June 2008 |
Launch price (MSRP) | $107 | $86 |
Place in performance rating | 1975 | not rated |
Processor Number | 3765U | 575 |
Series | Intel® Celeron® Processor 3000 Series | Legacy Intel® Celeron® Processor |
Status | Launched | Discontinued |
Vertical segment | Mobile | Mobile |
Performance |
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64 bit support | ||
Base frequency | 1.90 GHz | 2.00 GHz |
Bus Speed | 5 GT/s DMI2 | 667 MHz FSB |
Die size | 82 mm | 143 mm2 |
L1 cache | 128 KB | |
L2 cache | 512 KB | 1 MB |
L3 cache | 2 MB | |
Manufacturing process technology | 14 nm | 65 nm |
Maximum core temperature | 105°C | 100°C |
Maximum frequency | 1.9 GHz | 2 GHz |
Number of cores | 2 | 1 |
Number of threads | 2 | 1 |
Transistor count | 1300 Million | 291 million |
Front-side bus (FSB) | 667 MHz | |
VID voltage range | 0.95-1.30V | |
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 25.6 GB/s | |
Maximum memory size | 16 GB | |
Supported memory types | DDR3L 1333/1600 LPDDR3 1333/1600 | |
Graphics |
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Graphics base frequency | 300 MHz | |
Graphics max dynamic frequency | 850 MHz | |
Graphics max frequency | 850 MHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel HD Graphics | |
Graphics interfaces |
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DisplayPort | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | |
Wireless Display (WiDi) support | ||
Graphics API support |
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DirectX | 11.2/12 | |
Compatibility |
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Configurable TDP-down | 10 W | |
Configurable TDP-down Frequency | 600 MHz | |
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | 40mm x 24mm x 1.3mm | 35mm x 35mm |
Sockets supported | FCBGA1168 | PPGA478 |
Thermal Design Power (TDP) | 15 Watt | 31 Watt |
Peripherals |
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Max number of PCIe lanes | 12 | |
PCI Express revision | 2.0 | |
PCIe configurations | 4x1 2x4 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Smart Response technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
FSB parity | ||
Idle States | ||
Intel® Demand Based Switching | ||
Virtualization |
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AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |