AMD R-272F vs Intel Celeron 3765U

Comparative analysis of AMD R-272F and Intel Celeron 3765U processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics API support, Compatibility, Peripherals, Advanced Technologies, Virtualization, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).

AMD R-272F

Intel Celeron 3765U

Differences

Reasons to consider the AMD R-272F

Around 68% higher clock speed: 3.2 GHz vs 1.9 GHz
2x more L2 cache, more data can be stored in the L2 cache for quick access later

Maximum frequency	3.2 GHz vs 1.9 GHz
L2 cache	1 MB vs 512 KB

Reasons to consider the Intel Celeron 3765U

CPU is newer: launch date 3 year(s) 0 month(s) later
Around 5% higher maximum core temperature: 105°C vs 100 °C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 32 nm
Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
2.3x lower typical power consumption: 15 Watt vs 35 Watt
Around 8% better performance in PassMark - Single thread mark: 1171 vs 1087
Around 3% better performance in PassMark - CPU mark: 1252 vs 1215

Specifications (specs)
Launch date	1 June 2015 vs 21 May 2012
Maximum core temperature	105°C vs 100 °C
Manufacturing process technology	14 nm vs 32 nm
L1 cache	128 KB vs 96 KB
Thermal Design Power (TDP)	15 Watt vs 35 Watt
Benchmarks
PassMark - Single thread mark	1171 vs 1087
PassMark - CPU mark	1252 vs 1215

Compare benchmarks

CPU 1: AMD R-272F
CPU 2: Intel Celeron 3765U

PassMark - Single thread mark

CPU 1

CPU 2

1087

1171

PassMark - CPU mark

CPU 1

CPU 2

1215

1252

Name	AMD R-272F	Intel Celeron 3765U
PassMark - Single thread mark	1087	1171
PassMark - CPU mark	1215	1252
GFXBench 4.0 - Car Chase Offscreen (Frames)		691
GFXBench 4.0 - Car Chase Offscreen (Fps)		691
GFXBench 4.0 - Manhattan (Frames)		1225
GFXBench 4.0 - Manhattan (Fps)		1225
GFXBench 4.0 - T-Rex (Frames)		2168
GFXBench 4.0 - T-Rex (Fps)		2168

Compare specifications (specs)

	AMD R-272F	Intel Celeron 3765U
Essentials
Architecture codename	Piledriver	Broadwell
Launch date	21 May 2012	1 June 2015
Place in performance rating	2183	1975
Vertical segment	Embedded	Mobile
Launch price (MSRP)		$107
Processor Number		3765U
Series		Intel® Celeron® Processor 3000 Series
Status		Launched
Performance
64 bit support
Base frequency	2.7 GHz	1.90 GHz
L1 cache	96 KB	128 KB
L2 cache	1 MB	512 KB
Manufacturing process technology	32 nm	14 nm
Maximum core temperature	100 °C	105°C
Maximum frequency	3.2 GHz	1.9 GHz
Number of cores	2	2
Number of threads	2	2
Bus Speed		5 GT/s DMI2
Die size		82 mm
L3 cache		2 MB
Transistor count		1300 Million
Memory
Max memory channels	2	2
Maximum memory bandwidth	25.6 GB/s	25.6 GB/s
Supported memory types	DDR3-1600, DDR3L-1600, DDR3U-1600	DDR3L 1333/1600 LPDDR3 1333/1600
Maximum memory size		16 GB
Graphics
Graphics base frequency	497 MHz	300 MHz
Graphics max frequency	686 MHz	850 MHz
Number of pipelines	192
Processor graphics	Radeon HD 7520G	Intel HD Graphics
Unified Video Decoder (UVD)
Video Codec Engine (VCE)
Graphics max dynamic frequency		850 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Graphics interfaces
DisplayPort
DVI
HDMI
Number of displays supported	4	3
VGA
eDP
Wireless Display (WiDi) support
Graphics API support
DirectX	11	11.2/12
OpenGL	4.2
Compatibility
Max number of CPUs in a configuration	1	1
Sockets supported	FS1	FCBGA1168
Thermal Design Power (TDP)	35 Watt	15 Watt
Configurable TDP-down		10 W
Configurable TDP-down Frequency		600 MHz
Low Halogen Options Available
Package Size		40mm x 24mm x 1.3mm
Peripherals
Max number of PCIe lanes	16	12
PCI Express revision	2.0	2.0
PCIe configurations		4x1 2x4
Advanced Technologies
Enhanced Virus Protection (EVP)
Fused Multiply-Add 3 (FMA3)
Fused Multiply-Add 4 (FMA4)
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Instruction set extensions		Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Smart Response technology
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
Security & Reliability
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)