AMD R-272F vs Intel Celeron 3765U
Comparative analysis of AMD R-272F and Intel Celeron 3765U processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics API support, Compatibility, Peripherals, Advanced Technologies, Virtualization, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the AMD R-272F
- Around 68% higher clock speed: 3.2 GHz vs 1.9 GHz
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
Maximum frequency | 3.2 GHz vs 1.9 GHz |
L2 cache | 1 MB vs 512 KB |
Reasons to consider the Intel Celeron 3765U
- CPU is newer: launch date 3 year(s) 0 month(s) later
- Around 5% higher maximum core temperature: 105°C vs 100 °C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 32 nm
- Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
- 2.3x lower typical power consumption: 15 Watt vs 35 Watt
- Around 8% better performance in PassMark - Single thread mark: 1171 vs 1087
- Around 3% better performance in PassMark - CPU mark: 1252 vs 1215
Specifications (specs) | |
Launch date | 1 June 2015 vs 21 May 2012 |
Maximum core temperature | 105°C vs 100 °C |
Manufacturing process technology | 14 nm vs 32 nm |
L1 cache | 128 KB vs 96 KB |
Thermal Design Power (TDP) | 15 Watt vs 35 Watt |
Benchmarks | |
PassMark - Single thread mark | 1171 vs 1087 |
PassMark - CPU mark | 1252 vs 1215 |
Compare benchmarks
CPU 1: AMD R-272F
CPU 2: Intel Celeron 3765U
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD R-272F | Intel Celeron 3765U |
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PassMark - Single thread mark | 1087 | 1171 |
PassMark - CPU mark | 1215 | 1252 |
GFXBench 4.0 - Car Chase Offscreen (Frames) | 691 | |
GFXBench 4.0 - Car Chase Offscreen (Fps) | 691 | |
GFXBench 4.0 - Manhattan (Frames) | 1225 | |
GFXBench 4.0 - Manhattan (Fps) | 1225 | |
GFXBench 4.0 - T-Rex (Frames) | 2168 | |
GFXBench 4.0 - T-Rex (Fps) | 2168 |
Compare specifications (specs)
AMD R-272F | Intel Celeron 3765U | |
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Essentials |
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Architecture codename | Piledriver | Broadwell |
Launch date | 21 May 2012 | 1 June 2015 |
Place in performance rating | 2189 | 1979 |
Vertical segment | Embedded | Mobile |
Launch price (MSRP) | $107 | |
Processor Number | 3765U | |
Series | Intel® Celeron® Processor 3000 Series | |
Status | Launched | |
Performance |
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64 bit support | ||
Base frequency | 2.7 GHz | 1.90 GHz |
L1 cache | 96 KB | 128 KB |
L2 cache | 1 MB | 512 KB |
Manufacturing process technology | 32 nm | 14 nm |
Maximum core temperature | 100 °C | 105°C |
Maximum frequency | 3.2 GHz | 1.9 GHz |
Number of cores | 2 | 2 |
Number of threads | 2 | 2 |
Bus Speed | 5 GT/s DMI2 | |
Die size | 82 mm | |
L3 cache | 2 MB | |
Transistor count | 1300 Million | |
Memory |
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Max memory channels | 2 | 2 |
Maximum memory bandwidth | 25.6 GB/s | 25.6 GB/s |
Supported memory types | DDR3-1600, DDR3L-1600, DDR3U-1600 | DDR3L 1333/1600 LPDDR3 1333/1600 |
Maximum memory size | 16 GB | |
Graphics |
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Graphics base frequency | 497 MHz | 300 MHz |
Graphics max frequency | 686 MHz | 850 MHz |
Number of pipelines | 192 | |
Processor graphics | Radeon HD 7520G | Intel HD Graphics |
Unified Video Decoder (UVD) | ||
Video Codec Engine (VCE) | ||
Graphics max dynamic frequency | 850 MHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Graphics interfaces |
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DisplayPort | ||
DVI | ||
HDMI | ||
Number of displays supported | 4 | 3 |
VGA | ||
eDP | ||
Wireless Display (WiDi) support | ||
Graphics API support |
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DirectX | 11 | 11.2/12 |
OpenGL | 4.2 | |
Compatibility |
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Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | FS1 | FCBGA1168 |
Thermal Design Power (TDP) | 35 Watt | 15 Watt |
Configurable TDP-down | 10 W | |
Configurable TDP-down Frequency | 600 MHz | |
Low Halogen Options Available | ||
Package Size | 40mm x 24mm x 1.3mm | |
Peripherals |
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Max number of PCIe lanes | 16 | 12 |
PCI Express revision | 2.0 | 2.0 |
PCIe configurations | 4x1 2x4 | |
Advanced Technologies |
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Enhanced Virus Protection (EVP) | ||
Fused Multiply-Add 3 (FMA3) | ||
Fused Multiply-Add 4 (FMA4) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | |
Intel 64 | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Smart Response technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) |