Intel Celeron 550 vs Intel Core i5-540UM

Comparative analysis of Intel Celeron 550 and Intel Core i5-540UM processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Celeron 550

Intel Core i5-540UM

Differences

Reasons to consider the Intel Core i5-540UM

1 more cores, run more applications at once: 2 vs 1
Around 5% higher maximum core temperature: 105°C vs 100°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
Around 72% lower typical power consumption: 18 Watt vs 31 Watt
Around 24% better performance in PassMark - Single thread mark: 818 vs 662
3x better performance in PassMark - CPU mark: 1002 vs 334

Specifications (specs)
Number of cores	2 vs 1
Maximum core temperature	105°C vs 100°C
Manufacturing process technology	32 nm vs 65 nm
Thermal Design Power (TDP)	18 Watt vs 31 Watt
Benchmarks
PassMark - Single thread mark	818 vs 662
PassMark - CPU mark	1002 vs 334

Compare benchmarks

CPU 1: Intel Celeron 550
CPU 2: Intel Core i5-540UM

PassMark - Single thread mark

CPU 1

CPU 2

662

818

PassMark - CPU mark

CPU 1

CPU 2

334

1002

Name	Intel Celeron 550	Intel Core i5-540UM
PassMark - Single thread mark	662	818
PassMark - CPU mark	334	1002
Geekbench 4 - Single Core	955
Geekbench 4 - Multi-Core	918

Compare specifications (specs)

	Intel Celeron 550	Intel Core i5-540UM
Essentials
Architecture codename	Merom	Arrandale
Launch date	Q3'06	24 May 2010
Place in performance rating	2543	2535
Processor Number	550	i5-540UM
Series	Legacy Intel® Celeron® Processor	Legacy Intel® Core™ Processors
Status	Discontinued	Discontinued
Vertical segment	Mobile	Mobile
Launch price (MSRP)		$250
Performance
64 bit support
Base frequency	2.00 GHz	1.20 GHz
Bus Speed	533 MHz FSB	2.5 GT/s DMI
Die size	143 mm2	81 mm2
Manufacturing process technology	65 nm	32 nm
Maximum core temperature	100°C	105°C
Number of cores	1	2
Transistor count	291 million	382 million
VID voltage range	0.95V-1.30V
Front-side bus (FSB)		2500 MHz
L2 cache		512 KB
L3 cache		3 MB
Maximum frequency		2.00 GHz
Number of threads		4
Compatibility
Low Halogen Options Available
Package Size	35mm x 35mm	BGA 34mm x 28mm
Sockets supported	PPGA478, PBGA479	BGA1288
Thermal Design Power (TDP)	31 Watt	18 Watt
Max number of CPUs in a configuration		1
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Flexible Display interface (FDI)
Instruction set extensions		Intel® SSE4.1, Intel® SSE4.2
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE)		36-bit
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
Memory
Max memory channels		2
Maximum memory bandwidth		12.8 GB/s
Maximum memory size		8 GB
Supported memory types		DDR3 800
Graphics
Graphics base frequency		166 MHz
Graphics max dynamic frequency		500 MHz
Graphics max frequency		500 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® Flexible Display Interface (Intel® FDI)
Processor graphics		Intel HD Graphics
Graphics interfaces
Number of displays supported		2
Peripherals
Max number of PCIe lanes		16
PCI Express revision		2.0
PCIe configurations		1x16