Intel Celeron 550 vs Intel Core 2 Solo SU3500
Comparative analysis of Intel Celeron 550 and Intel Core 2 Solo SU3500 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Celeron 550
- Around 20% better performance in Geekbench 4 - Single Core: 955 vs 799
- Around 19% better performance in Geekbench 4 - Multi-Core: 918 vs 773
| Benchmarks | |
| Geekbench 4 - Single Core | 955 vs 799 |
| Geekbench 4 - Multi-Core | 918 vs 773 |
Reasons to consider the Intel Core 2 Solo SU3500
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
- 5.2x lower typical power consumption: 5.5 Watt vs 31 Watt
| Manufacturing process technology | 45 nm vs 65 nm |
| Thermal Design Power (TDP) | 5.5 Watt vs 31 Watt |
Compare benchmarks
CPU 1: Intel Celeron 550
CPU 2: Intel Core 2 Solo SU3500
| Geekbench 4 - Single Core |
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| Geekbench 4 - Multi-Core |
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| Name | Intel Celeron 550 | Intel Core 2 Solo SU3500 |
|---|---|---|
| PassMark - Single thread mark | 662 | |
| PassMark - CPU mark | 334 | |
| Geekbench 4 - Single Core | 955 | 799 |
| Geekbench 4 - Multi-Core | 918 | 773 |
Compare specifications (specs)
| Intel Celeron 550 | Intel Core 2 Solo SU3500 | |
|---|---|---|
Essentials |
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| Architecture codename | Merom | Penryn |
| Launch date | Q3'06 | 1 April 2009 |
| Place in performance rating | 2554 | 2569 |
| Processor Number | 550 | SU3500 |
| Series | Legacy Intel® Celeron® Processor | Legacy Intel® Core™ Processors |
| Status | Discontinued | Discontinued |
| Vertical segment | Mobile | Mobile |
| Launch price (MSRP) | $262 | |
Performance |
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| 64 bit support | ||
| Base frequency | 2.00 GHz | 1.30 GHz |
| Bus Speed | 533 MHz FSB | 800 MHz FSB |
| Die size | 143 mm2 | 107 mm2 |
| Manufacturing process technology | 65 nm | 45 nm |
| Maximum core temperature | 100°C | 100°C |
| Number of cores | 1 | 1 |
| Transistor count | 291 million | 410 million |
| VID voltage range | 0.95V-1.30V | 1.050V-1.150V |
| Front-side bus (FSB) | 800 MHz | |
| L1 cache | 64 KB | |
| L2 cache | 3072 KB | |
| Maximum frequency | 1.4 GHz | |
| Number of threads | 1 | |
Compatibility |
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| Low Halogen Options Available | ||
| Package Size | 35mm x 35mm | |
| Sockets supported | PPGA478, PBGA479 | BGA956 |
| Thermal Design Power (TDP) | 31 Watt | 5.5 Watt |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Idle States | ||
| Intel 64 | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
