Intel Celeron 827E vs AMD Athlon Neo X2 L335
Comparative analysis of Intel Celeron 827E and AMD Athlon Neo X2 L335 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Celeron 827E
- Around 5% higher maximum core temperature: 100 vs 95 °C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
- Around 6% lower typical power consumption: 17 Watt vs 18 Watt
- Around 18% better performance in PassMark - Single thread mark: 674 vs 570
Specifications (specs) | |
Maximum core temperature | 100 vs 95 °C |
Manufacturing process technology | 32 nm vs 65 nm |
Thermal Design Power (TDP) | 17 Watt vs 18 Watt |
Benchmarks | |
PassMark - Single thread mark | 674 vs 570 |
Reasons to consider the AMD Athlon Neo X2 L335
- 1 more cores, run more applications at once: 2 vs 1
- 1 more threads: 2 vs 1
- Around 43% better performance in PassMark - CPU mark: 529 vs 371
Specifications (specs) | |
Number of cores | 2 vs 1 |
Number of threads | 2 vs 1 |
Benchmarks | |
PassMark - CPU mark | 529 vs 371 |
Compare benchmarks
CPU 1: Intel Celeron 827E
CPU 2: AMD Athlon Neo X2 L335
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Celeron 827E | AMD Athlon Neo X2 L335 |
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PassMark - Single thread mark | 674 | 570 |
PassMark - CPU mark | 371 | 529 |
Geekbench 4 - Single Core | 786 | |
Geekbench 4 - Multi-Core | 1289 |
Compare specifications (specs)
Intel Celeron 827E | AMD Athlon Neo X2 L335 | |
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Essentials |
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Architecture codename | Sandy Bridge | Congo |
Launch date | Q3'11 | 1 October 2009 |
Place in performance rating | 2746 | 2684 |
Processor Number | 827E | |
Series | Legacy Intel® Celeron® Processor | 2x AMD Athlon Neo |
Status | Launched | |
Vertical segment | Embedded | Laptop |
Performance |
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64 bit support | ||
Base frequency | 1.40 GHz | |
Manufacturing process technology | 32 nm | 65 nm |
Maximum core temperature | 100 | 95 °C |
Number of cores | 1 | 2 |
Number of threads | 1 | 2 |
Front-side bus (FSB) | 800 MHz | |
L1 cache | 128 KB | |
L2 cache | 512 KB | |
Maximum frequency | 1.6 GHz | |
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 21.3 GB/s | |
Maximum memory size | 16.6 GB | |
Supported memory types | DDR3 1066/1333 | |
Graphics |
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Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 800 MHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel HD Graphics | |
Graphics interfaces |
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CRT | ||
DisplayPort | ||
eDP | ||
HDMI | ||
Number of displays supported | 2 | |
SDVO | ||
Compatibility |
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Low Halogen Options Available | ||
Package Size | 31mm x 24mm (FCBGA1023) | |
Sockets supported | FCBGA1023 | ASB1 BGA |
Thermal Design Power (TDP) | 17 Watt | 18 Watt |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 2.0 | |
PCIe configurations | 1x16, 2x8, 1x8 2x4 | |
Security & Reliability |
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Anti-Theft technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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4G WiMAX Wireless | ||
Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® My WiFi technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
VirusProtect | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
AMD Virtualization (AMD-V™) |