Intel Celeron 827E vs AMD Athlon Neo X2 L335

Comparative analysis of Intel Celeron 827E and AMD Athlon Neo X2 L335 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Celeron 827E

AMD Athlon Neo X2 L335

Differences

Reasons to consider the Intel Celeron 827E

Around 5% higher maximum core temperature: 100 vs 95 °C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
Around 6% lower typical power consumption: 17 Watt vs 18 Watt
Around 18% better performance in PassMark - Single thread mark: 674 vs 570

Specifications (specs)
Maximum core temperature	100 vs 95 °C
Manufacturing process technology	32 nm vs 65 nm
Thermal Design Power (TDP)	17 Watt vs 18 Watt
Benchmarks
PassMark - Single thread mark	674 vs 570

Reasons to consider the AMD Athlon Neo X2 L335

1 more cores, run more applications at once: 2 vs 1
1 more threads: 2 vs 1
Around 43% better performance in PassMark - CPU mark: 529 vs 371

Specifications (specs)
Number of cores	2 vs 1
Number of threads	2 vs 1
Benchmarks
PassMark - CPU mark	529 vs 371

Compare benchmarks

CPU 1: Intel Celeron 827E
CPU 2: AMD Athlon Neo X2 L335

PassMark - Single thread mark

CPU 1

CPU 2

674

570

PassMark - CPU mark

CPU 1

CPU 2

371

529

Name	Intel Celeron 827E	AMD Athlon Neo X2 L335
PassMark - Single thread mark	674	570
PassMark - CPU mark	371	529
Geekbench 4 - Single Core		786
Geekbench 4 - Multi-Core		1289

Compare specifications (specs)

	Intel Celeron 827E	AMD Athlon Neo X2 L335
Essentials
Architecture codename	Sandy Bridge	Congo
Launch date	Q3'11	1 October 2009
Place in performance rating	2745	2681
Processor Number	827E
Series	Legacy Intel® Celeron® Processor	2x AMD Athlon Neo
Status	Launched
Vertical segment	Embedded	Laptop
Performance
64 bit support
Base frequency	1.40 GHz
Manufacturing process technology	32 nm	65 nm
Maximum core temperature	100	95 °C
Number of cores	1	2
Number of threads	1	2
Front-side bus (FSB)		800 MHz
L1 cache		128 KB
L2 cache		512 KB
Maximum frequency		1.6 GHz
Memory
Max memory channels	2
Maximum memory bandwidth	21.3 GB/s
Maximum memory size	16.6 GB
Supported memory types	DDR3 1066/1333
Graphics
Graphics base frequency	350 MHz
Graphics max dynamic frequency	800 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel HD Graphics
Graphics interfaces
CRT
DisplayPort
eDP
HDMI
Number of displays supported	2
SDVO
Compatibility
Low Halogen Options Available
Package Size	31mm x 24mm (FCBGA1023)
Sockets supported	FCBGA1023	ASB1 BGA
Thermal Design Power (TDP)	17 Watt	18 Watt
Peripherals
Max number of PCIe lanes	16
PCI Express revision	2.0
PCIe configurations	1x16, 2x8, 1x8 2x4
Security & Reliability
Anti-Theft technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
VirusProtect
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
AMD Virtualization (AMD-V™)