Intel Celeron 827E vs Intel Atom Z3740
Comparative analysis of Intel Celeron 827E and Intel Atom Z3740 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the Intel Celeron 827E
- Around 11% higher maximum core temperature: 100 vs 90°C
- 4.1x more maximum memory size: 16.6 GB vs 4 GB
- Around 64% better performance in PassMark - Single thread mark: 674 vs 410
| Specifications (specs) | |
| Maximum core temperature | 100 vs 90°C |
| Maximum memory size | 16.6 GB vs 4 GB |
| Benchmarks | |
| PassMark - Single thread mark | 674 vs 410 |
Reasons to consider the Intel Atom Z3740
- 3 more cores, run more applications at once: 4 vs 1
- 3 more threads: 4 vs 1
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
- 8.5x lower typical power consumption: 2 Watt vs 17 Watt
- Around 67% better performance in PassMark - CPU mark: 621 vs 371
| Specifications (specs) | |
| Number of cores | 4 vs 1 |
| Number of threads | 4 vs 1 |
| Manufacturing process technology | 22 nm vs 32 nm |
| Thermal Design Power (TDP) | 2 Watt vs 17 Watt |
| Benchmarks | |
| PassMark - CPU mark | 621 vs 371 |
Compare benchmarks
CPU 1: Intel Celeron 827E
CPU 2: Intel Atom Z3740
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Celeron 827E | Intel Atom Z3740 |
|---|---|---|
| PassMark - Single thread mark | 674 | 410 |
| PassMark - CPU mark | 371 | 621 |
| GFXBench 4.0 - T-Rex (Frames) | 1237 | |
| GFXBench 4.0 - T-Rex (Fps) | 1237 |
Compare specifications (specs)
| Intel Celeron 827E | Intel Atom Z3740 | |
|---|---|---|
Essentials |
||
| Architecture codename | Sandy Bridge | Bay Trail |
| Launch date | Q3'11 | September 2013 |
| Place in performance rating | 2744 | 2759 |
| Processor Number | 827E | Z3740 |
| Series | Legacy Intel® Celeron® Processor | Intel® Atom™ Processor Z Series |
| Status | Launched | Discontinued |
| Vertical segment | Embedded | Mobile |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.40 GHz | 1.33 GHz |
| Manufacturing process technology | 32 nm | 22 nm |
| Maximum core temperature | 100 | 90°C |
| Number of cores | 1 | 4 |
| Number of threads | 1 | 4 |
| L1 cache | 64 KB (per core) | |
| L2 cache | 512 KB (per core) | |
| Maximum frequency | 1.86 GHz | |
Memory |
||
| Max memory channels | 2 | 2 |
| Maximum memory bandwidth | 21.3 GB/s | 17.1 GB/s |
| Maximum memory size | 16.6 GB | 4 GB |
| Supported memory types | DDR3 1066/1333 | LPDDR3 1066 |
Graphics |
||
| Graphics base frequency | 350 MHz | 311 MHz |
| Graphics max dynamic frequency | 800 MHz | |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Processor graphics | Intel HD Graphics | Intel HD Graphics |
| Graphics max frequency | 667 MHz | |
Graphics interfaces |
||
| CRT | ||
| DisplayPort | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 2 | |
| SDVO | ||
| Wireless Display (WiDi) support | ||
Compatibility |
||
| Low Halogen Options Available | ||
| Package Size | 31mm x 24mm (FCBGA1023) | 17mm x 17mm |
| Sockets supported | FCBGA1023 | UTFCBGA1380 |
| Thermal Design Power (TDP) | 17 Watt | 2 Watt |
| Max number of CPUs in a configuration | 1 | |
| Scenario Design Power (SDP) | 2 W | |
Peripherals |
||
| Max number of PCIe lanes | 16 | |
| PCI Express revision | 2.0 | |
| PCIe configurations | 1x16, 2x8, 1x8 2x4 | |
Security & Reliability |
||
| Anti-Theft technology | ||
| Intel® Trusted Execution technology (TXT) | ||
| Intel® Identity Protection technology | ||
| Intel® Secure Key technology | ||
Advanced Technologies |
||
| 4G WiMAX Wireless | ||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Fast Memory Access | ||
| Intel® Flex Memory Access | ||
| Intel® Hyper-Threading technology | ||
| Intel® My WiFi technology | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||