Intel Celeron 827E vs AMD Turion 64 X2 TL-50

Comparative analysis of Intel Celeron 827E and AMD Turion 64 X2 TL-50 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Celeron 827E

AMD Turion 64 X2 TL-50

Differences

Reasons to consider the Intel Celeron 827E

A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 90 nm
Around 82% lower typical power consumption: 17 Watt vs 31 Watt
Around 25% better performance in PassMark - Single thread mark: 674 vs 541

Specifications (specs)
Manufacturing process technology	32 nm vs 90 nm
Thermal Design Power (TDP)	17 Watt vs 31 Watt
Benchmarks
PassMark - Single thread mark	674 vs 541

Reasons to consider the AMD Turion 64 X2 TL-50

1 more cores, run more applications at once: 2 vs 1
1 more threads: 2 vs 1
Around 28% better performance in PassMark - CPU mark: 474 vs 371

Specifications (specs)
Number of cores	2 vs 1
Number of threads	2 vs 1
Benchmarks
PassMark - CPU mark	474 vs 371

Compare benchmarks

CPU 1: Intel Celeron 827E
CPU 2: AMD Turion 64 X2 TL-50

PassMark - Single thread mark

CPU 1

CPU 2

674

541

PassMark - CPU mark

CPU 1

CPU 2

371

474

Name	Intel Celeron 827E	AMD Turion 64 X2 TL-50
PassMark - Single thread mark	674	541
PassMark - CPU mark	371	474
Geekbench 4 - Single Core		795
Geekbench 4 - Multi-Core		1357

Compare specifications (specs)

	Intel Celeron 827E	AMD Turion 64 X2 TL-50
Essentials
Architecture codename	Sandy Bridge	Taylor
Launch date	Q3'11	17 May 2006
Place in performance rating	2744	2701
Processor Number	827E
Series	Legacy Intel® Celeron® Processor	2x AMD Turion 64
Status	Launched
Vertical segment	Embedded	Laptop
Launch price (MSRP)		$154
Performance
64 bit support
Base frequency	1.40 GHz
Manufacturing process technology	32 nm	90 nm
Maximum core temperature	100
Number of cores	1	2
Number of threads	1	2
Die size		147 mm
Front-side bus (FSB)		800 MHz
L2 cache		512 KB
Maximum frequency		1.6 GHz
Transistor count		154 Million
Memory
Max memory channels	2
Maximum memory bandwidth	21.3 GB/s
Maximum memory size	16.6 GB
Supported memory types	DDR3 1066/1333
Graphics
Graphics base frequency	350 MHz
Graphics max dynamic frequency	800 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel HD Graphics
Graphics interfaces
CRT
DisplayPort
eDP
HDMI
Number of displays supported	2
SDVO
Compatibility
Low Halogen Options Available
Package Size	31mm x 24mm (FCBGA1023)
Sockets supported	FCBGA1023	S1
Thermal Design Power (TDP)	17 Watt	31 Watt
Peripherals
Max number of PCIe lanes	16
PCI Express revision	2.0
PCIe configurations	1x16, 2x8, 1x8 2x4
Security & Reliability
Anti-Theft technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)