Intel Celeron 827E vs AMD Turion 64 X2 TL-50

Comparative analysis of Intel Celeron 827E and AMD Turion 64 X2 TL-50 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Celeron 827E

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 90 nm
  • Around 82% lower typical power consumption: 17 Watt vs 31 Watt
  • Around 25% better performance in PassMark - Single thread mark: 674 vs 541
Specifications (specs)
Manufacturing process technology 32 nm vs 90 nm
Thermal Design Power (TDP) 17 Watt vs 31 Watt
Benchmarks
PassMark - Single thread mark 674 vs 541

Reasons to consider the AMD Turion 64 X2 TL-50

  • 1 more cores, run more applications at once: 2 vs 1
  • 1 more threads: 2 vs 1
  • Around 28% better performance in PassMark - CPU mark: 474 vs 371
Specifications (specs)
Number of cores 2 vs 1
Number of threads 2 vs 1
Benchmarks
PassMark - CPU mark 474 vs 371

Compare benchmarks

CPU 1: Intel Celeron 827E
CPU 2: AMD Turion 64 X2 TL-50

PassMark - Single thread mark
CPU 1
CPU 2
674
541
PassMark - CPU mark
CPU 1
CPU 2
371
474
Name Intel Celeron 827E AMD Turion 64 X2 TL-50
PassMark - Single thread mark 674 541
PassMark - CPU mark 371 474
Geekbench 4 - Single Core 795
Geekbench 4 - Multi-Core 1357

Compare specifications (specs)

Intel Celeron 827E AMD Turion 64 X2 TL-50

Essentials

Architecture codename Sandy Bridge Taylor
Launch date Q3'11 17 May 2006
Place in performance rating 2746 2690
Processor Number 827E
Series Legacy Intel® Celeron® Processor 2x AMD Turion 64
Status Launched
Vertical segment Embedded Laptop
Launch price (MSRP) $154

Performance

64 bit support
Base frequency 1.40 GHz
Manufacturing process technology 32 nm 90 nm
Maximum core temperature 100
Number of cores 1 2
Number of threads 1 2
Die size 147 mm
Front-side bus (FSB) 800 MHz
L2 cache 512 KB
Maximum frequency 1.6 GHz
Transistor count 154 Million

Memory

Max memory channels 2
Maximum memory bandwidth 21.3 GB/s
Maximum memory size 16.6 GB
Supported memory types DDR3 1066/1333

Graphics

Graphics base frequency 350 MHz
Graphics max dynamic frequency 800 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics Intel HD Graphics

Graphics interfaces

CRT
DisplayPort
eDP
HDMI
Number of displays supported 2
SDVO

Compatibility

Low Halogen Options Available
Package Size 31mm x 24mm (FCBGA1023)
Sockets supported FCBGA1023 S1
Thermal Design Power (TDP) 17 Watt 31 Watt

Peripherals

Max number of PCIe lanes 16
PCI Express revision 2.0
PCIe configurations 1x16, 2x8, 1x8 2x4

Security & Reliability

Anti-Theft technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)