Intel Celeron B720 vs Intel Atom E660
Comparative analysis of Intel Celeron B720 and Intel Atom E660 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Celeron B720
- CPU is newer: launch date 1 year(s) 4 month(s) later
- Around 31% higher clock speed: 1.7 GHz vs 1.3 GHz
- Around 11% higher maximum core temperature: 100 °C vs 90°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
- 8x more maximum memory size: 16 GB vs 2 GB
- 3x better performance in PassMark - CPU mark: 814 vs 271
Specifications (specs) | |
Launch date | 1 January 2012 vs September 2010 |
Maximum frequency | 1.7 GHz vs 1.3 GHz |
Maximum core temperature | 100 °C vs 90°C |
Manufacturing process technology | 32 nm vs 45 nm |
Maximum memory size | 16 GB vs 2 GB |
Benchmarks | |
PassMark - CPU mark | 814 vs 271 |
Reasons to consider the Intel Atom E660
- 1 more threads: 2 vs 1
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- 8.8x lower typical power consumption: 3.6 Watt vs 35 Watt
Number of threads | 2 vs 1 |
L2 cache | 512 KB (per core) vs 256 KB (per core) |
Thermal Design Power (TDP) | 3.6 Watt vs 35 Watt |
Compare benchmarks
CPU 1: Intel Celeron B720
CPU 2: Intel Atom E660
PassMark - CPU mark |
|
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Name | Intel Celeron B720 | Intel Atom E660 |
---|---|---|
PassMark - Single thread mark | 0 | 0 |
PassMark - CPU mark | 814 | 271 |
Compare specifications (specs)
Intel Celeron B720 | Intel Atom E660 | |
---|---|---|
Essentials |
||
Architecture codename | Sandy Bridge | Tunnel Creek |
Launch date | 1 January 2012 | September 2010 |
Place in performance rating | 3335 | 3340 |
Processor Number | B720 | E660 |
Series | Legacy Intel® Celeron® Processor | Legacy Intel Atom® Processors |
Status | Launched | Launched |
Vertical segment | Mobile | Embedded |
Launch price (MSRP) | $54 | |
Price now | $54 | |
Value for money (0-100) | 1.48 | |
Performance |
||
64 bit support | ||
Base frequency | 1.70 GHz | 1.30 GHz |
Bus Speed | 5 GT/s DMI | 2500 MHz PCIE |
Die size | 131 mm | 26 mm |
L1 cache | 64 KB (per core) | 64 KB (per core) |
L2 cache | 256 KB (per core) | 512 KB (per core) |
L3 cache | 1.5 MB | |
Manufacturing process technology | 32 nm | 45 nm |
Maximum core temperature | 100 °C | 90°C |
Maximum frequency | 1.7 GHz | 1.3 GHz |
Number of cores | 1 | 1 |
Number of threads | 1 | 2 |
Transistor count | 504 million | 47 million |
VID voltage range | VCC (0.75 - 0.9V), VNN (0.75 - 1.1V) | |
Memory |
||
Max memory channels | 2 | 1 |
Maximum memory bandwidth | 21.3 GB/s | |
Maximum memory size | 16 GB | 2 GB |
Supported memory types | DDR3 1066/1333 | DDR2 800 |
Graphics |
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Graphics base frequency | 650 MHz | 400 MHz |
Graphics max dynamic frequency | 1.00 GHz | |
Graphics max frequency | 1 GHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel HD Graphics | Integrated |
Graphics interfaces |
||
CRT | ||
DisplayPort | ||
eDP | ||
HDMI | ||
Number of displays supported | 2 | |
SDVO | ||
Wireless Display (WiDi) support | ||
Compatibility |
||
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mmx37.5mm (rPGA988B) | 22mmx22mm |
Sockets supported | PGA988 | FCBGA676 |
Thermal Design Power (TDP) | 35 Watt | 3.6 Watt |
Peripherals |
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Max number of PCIe lanes | 16 | 4 |
PCI Express revision | 2.0 | 1.0a |
PCIe configurations | 1x16, 2x8, 1x8 2x4 | x1, root complex only |
Security & Reliability |
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Anti-Theft technology | ||
Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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4G WiMAX Wireless | ||
Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® My WiFi technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
FSB parity | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) |