Intel Celeron G1610 vs AMD Phenom II X2 B55

Comparative analysis of Intel Celeron G1610 and AMD Phenom II X2 B55 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps), CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

Intel Celeron G1610

AMD Phenom II X2 B55

Differences

Reasons to consider the Intel Celeron G1610

CPU is newer: launch date 3 year(s) 2 month(s) later
A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
Around 45% lower typical power consumption: 55 Watt vs 80 Watt
Around 15% better performance in PassMark - Single thread mark: 1376 vs 1201
Around 28% better performance in PassMark - CPU mark: 1518 vs 1183
2.2x better performance in CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s): 22.539 vs 10.41

Specifications (specs)
Launch date	December 2012 vs October 2009
Manufacturing process technology	22 nm vs 45 nm
Thermal Design Power (TDP)	55 Watt vs 80 Watt
Benchmarks
PassMark - Single thread mark	1376 vs 1201
PassMark - CPU mark	1518 vs 1183
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)	22.539 vs 10.41

Reasons to consider the AMD Phenom II X2 B55

Around 15% higher clock speed: 3 GHz vs 2.6 GHz
2x more L1 cache, more data can be stored in the L1 cache for quick access later
2x more L2 cache, more data can be stored in the L2 cache for quick access later
3x more L3 cache, more data can be stored in the L3 cache for quick access later
3.8x better performance in Geekbench 4 - Single Core: 1851 vs 482
3.2x better performance in Geekbench 4 - Multi-Core: 2854 vs 900

Specifications (specs)
Maximum frequency	3 GHz vs 2.6 GHz
L1 cache	128 KB (per core) vs 64 KB (per core)
L2 cache	512 KB (per core) vs 256 KB (per core)
L3 cache	6144 KB (shared) vs 2048 KB (shared)
Benchmarks
Geekbench 4 - Single Core	1851 vs 482
Geekbench 4 - Multi-Core	2854 vs 900

Compare benchmarks

CPU 1: Intel Celeron G1610
CPU 2: AMD Phenom II X2 B55

PassMark - Single thread mark

CPU 1

CPU 2

1376

1201

PassMark - CPU mark

CPU 1

CPU 2

1518

1183

Geekbench 4 - Single Core

CPU 1

CPU 2

482

1851

Geekbench 4 - Multi-Core

CPU 1

CPU 2

900

2854

CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)

CPU 1

CPU 2

22.539

10.41

Name	Intel Celeron G1610	AMD Phenom II X2 B55
PassMark - Single thread mark	1376	1201
PassMark - CPU mark	1518	1183
Geekbench 4 - Single Core	482	1851
Geekbench 4 - Multi-Core	900	2854
3DMark Fire Strike - Physics Score	0
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)	22.539	10.41
GFXBench 4.0 - T-Rex (Frames)	1768
GFXBench 4.0 - T-Rex (Fps)	1768
CompuBench 1.5 Desktop - Face Detection (mPixels/s)		3.707
CompuBench 1.5 Desktop - T-Rex (Frames/s)		0.191
CompuBench 1.5 Desktop - Video Composition (Frames/s)		0.318
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)		3.556

Compare specifications (specs)

	Intel Celeron G1610	AMD Phenom II X2 B55
Essentials
Architecture codename	Ivy Bridge	Callisto
Launch date	December 2012	October 2009
Launch price (MSRP)	$388	$48
Place in performance rating	2488	2495
Price now	$24.99	$48
Processor Number	G1610
Series	Intel® Celeron® Processor G Series
Status	Launched
Value for money (0-100)	29.34	11.85
Vertical segment	Desktop	Desktop
Performance
64 bit support
Base frequency	2.60 GHz
Bus Speed	5 GT/s DMI
Die size	94 mm	258 mm
L1 cache	64 KB (per core)	128 KB (per core)
L2 cache	256 KB (per core)	512 KB (per core)
L3 cache	2048 KB (shared)	6144 KB (shared)
Manufacturing process technology	22 nm	45 nm
Maximum case temperature (TCase)	65 °C
Maximum frequency	2.6 GHz	3 GHz
Number of cores	2	2
Number of threads	2
Transistor count		758 million
Memory
ECC memory support
Max memory channels	2
Maximum memory bandwidth	21 GB/s
Maximum memory size	32 GB
Supported memory types	DDR3 1333	DDR3
Graphics
Graphics base frequency	650 MHz
Graphics max dynamic frequency	1.05 GHz
Graphics max frequency	1.05 GHz
Intel® Clear Video HD technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel HD Graphics
Graphics interfaces
Number of displays supported	3
Wireless Display (WiDi) support
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	37.5mm x 37.5mm
Sockets supported	FCLGA1155	AM3
Thermal Design Power (TDP)	55 Watt	80 Watt
Thermal Solution	2011C
Peripherals
PCI Express revision	2.0
PCIe configurations	up to 1x16, 2x8, 1x8 & 2x4
Scalability	1S Only
Security & Reliability
Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Optane™ Memory Supported
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)