Intel Celeron G1820TE vs Intel Core i3-330UM

Comparative analysis of Intel Celeron G1820TE and Intel Core i3-330UM processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Celeron G1820TE

  • CPU is newer: launch date 3 year(s) 6 month(s) later
  • Around 83% higher clock speed: 2.2 GHz vs 1.2 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
  • 4x more maximum memory size: 32 GB vs 8 GB
  • 2.5x better performance in PassMark - Single thread mark: 978 vs 392
  • Around 84% better performance in PassMark - CPU mark: 1020 vs 555
Specifications (specs)
Launch date December 2013 vs 24 May 2010
Maximum frequency 2.2 GHz vs 1.2 GHz
Manufacturing process technology 22 nm vs 32 nm
Maximum memory size 32 GB vs 8 GB
Benchmarks
PassMark - Single thread mark 978 vs 392
PassMark - CPU mark 1020 vs 555

Reasons to consider the Intel Core i3-330UM

  • 2 more threads: 4 vs 2
  • Around 94% lower typical power consumption: 18 Watt vs 35 Watt
Number of threads 4 vs 2
Thermal Design Power (TDP) 18 Watt vs 35 Watt

Compare benchmarks

CPU 1: Intel Celeron G1820TE
CPU 2: Intel Core i3-330UM

PassMark - Single thread mark
CPU 1
CPU 2
978
392
PassMark - CPU mark
CPU 1
CPU 2
1020
555
Name Intel Celeron G1820TE Intel Core i3-330UM
PassMark - Single thread mark 978 392
PassMark - CPU mark 1020 555
3DMark Fire Strike - Physics Score 882
Geekbench 4 - Single Core 951
Geekbench 4 - Multi-Core 1848

Compare specifications (specs)

Intel Celeron G1820TE Intel Core i3-330UM

Essentials

Architecture codename Haswell Arrandale
Launch date December 2013 24 May 2010
Place in performance rating 2659 2646
Processor Number G1820TE i3-330UM
Series Intel® Celeron® Processor G Series Legacy Intel® Core™ Processors
Status Launched Discontinued
Vertical segment Embedded Mobile

Performance

64 bit support
Base frequency 2.20 GHz 1.20 GHz
Bus Speed 5 GT/s DMI2 2.5 GT/s DMI
Die size 177 mm 81 mm2
L1 cache 64 KB (per core)
L2 cache 256 KB (per core) 512 KB
L3 cache 3072 KB (shared) 3072 KB
Manufacturing process technology 22 nm 32 nm
Maximum case temperature (TCase) 72 °C
Maximum frequency 2.2 GHz 1.2 GHz
Number of cores 2 2
Number of threads 2 4
Transistor count 1400 million 382 million
Front-side bus (FSB) 2500 MHz
Maximum core temperature 105°C

Memory

ECC memory support
Max memory channels 2 2
Maximum memory bandwidth 21.3 GB/s 12.8 GB/s
Maximum memory size 32 GB 8 GB
Supported memory types DDR3 1333 DDR3 800

Graphics

Graphics base frequency 350 MHz 166 MHz
Graphics max dynamic frequency 1.00 GHz 500 MHz
Graphics max frequency 1 GHz 500 MHz
Intel® Flexible Display Interface (Intel® FDI)
Intel® Quick Sync Video
Max video memory 1.7 GB
Processor graphics Intel HD Graphics Intel HD Graphics
Intel® Clear Video HD technology
Intel® Clear Video technology

Graphics interfaces

DisplayPort
DVI
eDP
HDMI
Number of displays supported 3 2
VGA

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Package Size 37.5mm x 37.5mm BGA 34mm x 28mm
Sockets supported FCLGA1150 BGA1288
Thermal Design Power (TDP) 35 Watt 18 Watt
Thermal Solution PCG 2013A

Peripherals

Max number of PCIe lanes 16 16
PCI Express revision Up to 3.0 2.0
PCIe configurations Up to 1x16, 2x8, 1x8/2x4 1x16
Scalability 1S Only

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2 Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Intel® Fast Memory Access
Intel® Flex Memory Access
Physical Address Extensions (PAE) 36-bit

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)

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