Intel Celeron G1820TE processor review

Celeron G1820TE processor released by Intel; release date: December 2013. The processor is designed for embedded-computers and based on Haswell microarchitecture.

CPU is locked to prevent overclocking. Total number of cores - 2, threads - 2. Maximum CPU clock speed - 2.2 GHz. Manufacturing process technology - 22 nm. Cache size: L1 - 64 KB (per core), L2 - 256 KB (per core), L3 - 3072 KB (shared).

Supported memory types: DDR3 1333. Maximum memory size: 32 GB.

Supported socket types: FCLGA1150. Maximum number of processors in a configuration - 1. Power consumption (TDP): 35 Watt.

The processor has integrated graphics Intel HD Graphics with the following parameters: maximum frequency - 1 GHz, maximum video memory size - 1.7 GB.

Benchmarks

PassMark
Single thread mark

Top 1 CPU

This CPU

4843

978

PassMark
CPU mark

Top 1 CPU

This CPU

185062

1020

3DMark Fire Strike
Physics Score

Top 1 CPU

This CPU

24923

882

Name	Value
PassMark - Single thread mark	978
PassMark - CPU mark	1020
3DMark Fire Strike - Physics Score	882

Specifications (specs)

Essentials
Architecture codename	Haswell
Launch date	December 2013
Place in performance rating	2611
Processor Number	G1820TE
Series	Intel® Celeron® Processor G Series
Status	Launched
Vertical segment	Embedded
Performance
64 bit support
Base frequency	2.20 GHz
Bus Speed	5 GT/s DMI2
Die size	177 mm
L1 cache	64 KB (per core)
L2 cache	256 KB (per core)
L3 cache	3072 KB (shared)
Manufacturing process technology	22 nm
Maximum case temperature (TCase)	72 °C
Maximum frequency	2.2 GHz
Number of cores	2
Number of threads	2
Transistor count	1400 million

Memory
ECC memory support
Max memory channels	2
Maximum memory bandwidth	21.3 GB/s
Maximum memory size	32 GB
Supported memory types	DDR3 1333
Graphics
Graphics base frequency	350 MHz
Graphics max dynamic frequency	1.00 GHz
Graphics max frequency	1 GHz
Intel® Flexible Display Interface (Intel® FDI)
Intel® Quick Sync Video
Max video memory	1.7 GB
Processor graphics	Intel HD Graphics
Graphics interfaces
DisplayPort
DVI
eDP
HDMI
Number of displays supported	3
VGA
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1
Package Size	37.5mm x 37.5mm
Sockets supported	FCLGA1150
Thermal Design Power (TDP)	35 Watt
Thermal Solution	PCG 2013A
Peripherals
Max number of PCIe lanes	16
PCI Express revision	Up to 3.0
PCIe configurations	Up to 1x16, 2x8, 1x8/2x4
Scalability	1S Only
Security & Reliability
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)