Intel Celeron G3900E vs AMD A8-5550M

Comparative analysis of Intel Celeron G3900E and AMD A8-5550M processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).

Intel Celeron G3900E

AMD A8-5550M

Differences

Reasons to consider the Intel Celeron G3900E

A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 32 nm
Around 44% better performance in PassMark - Single thread mark: 1499 vs 1039
Around 9% better performance in PassMark - CPU mark: 2034 vs 1869

Specifications (specs)
Manufacturing process technology	14 nm vs 32 nm
Benchmarks
PassMark - Single thread mark	1499 vs 1039
PassMark - CPU mark	2034 vs 1869

Reasons to consider the AMD A8-5550M

2 more cores, run more applications at once: 4 vs 2
2 more threads: 4 vs 2

Number of cores	4 vs 2
Number of threads	4 vs 2

Compare benchmarks

CPU 1: Intel Celeron G3900E
CPU 2: AMD A8-5550M

PassMark - Single thread mark

CPU 1

CPU 2

1499

1039

PassMark - CPU mark

CPU 1

CPU 2

2034

1869

Name	Intel Celeron G3900E	AMD A8-5550M
PassMark - Single thread mark	1499	1039
PassMark - CPU mark	2034	1869
Geekbench 4 - Single Core		369
Geekbench 4 - Multi-Core		924
CompuBench 1.5 Desktop - Face Detection (mPixels/s)		3.83
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)		7.997
CompuBench 1.5 Desktop - T-Rex (Frames/s)		0.148
CompuBench 1.5 Desktop - Video Composition (Frames/s)		10.477
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)		2.546
GFXBench 4.0 - Car Chase Offscreen (Frames)		634
GFXBench 4.0 - Manhattan (Frames)		2542
GFXBench 4.0 - T-Rex (Frames)		6126
GFXBench 4.0 - Car Chase Offscreen (Fps)		634
GFXBench 4.0 - Manhattan (Fps)		2542
GFXBench 4.0 - T-Rex (Fps)		6126

Compare specifications (specs)

	Intel Celeron G3900E	AMD A8-5550M
Essentials
Architecture codename	Skylake	Richland
Launch date	Q1'16	12 March 2013
Place in performance rating	1723	1711
Processor Number	G3900E
Series	Intel® Celeron® Processor G Series	AMD A-Series
Status	Launched
Vertical segment	Embedded	Laptop
Performance
64 bit support
Base frequency	2.40 GHz
Bus Speed	8 GT/s DMI3
Manufacturing process technology	14 nm	32 nm
Maximum core temperature	100°C
Number of cores	2	4
Number of threads	2	4
Die size		246 mm
L1 cache		128 KB (per core)
L2 cache		4096 KB
Maximum case temperature (TCase)		71 °C
Maximum frequency		3.1 GHz
Transistor count		1178 million
Memory
Max memory channels	2
Maximum memory bandwidth	34.1 GB/s
Maximum memory size	64 GB
Supported memory types	DDR4-1866/2133, DDR3L-1333/1600 @ 1.35V	DDR3
Graphics
Device ID	0x1902
Graphics base frequency	350 MHz
Graphics max dynamic frequency	950 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory	64 GB
Processor graphics	Intel® HD Graphics 510
Graphics interfaces
DisplayPort
DVI
eDP
HDMI
Number of displays supported	3
Graphics image quality
4K resolution support
Max resolution over DisplayPort	4096x2304@60Hz
Max resolution over eDP	4096x2304@60Hz
Max resolution over HDMI 1.4	4096x2304@24Hz
Graphics API support
DirectX	12
OpenGL	4.4
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	42mm x 28mm
Sockets supported	FCBGA1440	FS1r2
Thermal Design Power (TDP)	35 Watt	35 Watt
Peripherals
Max number of PCIe lanes	16
PCI Express revision	3.0
PCIe configurations	Up to 1x16, 2x8, 1x8+2x4
Scalability	1S Only
Security & Reliability
Execute Disable Bit (EDB)
Intel® Memory Protection Extensions (Intel® MPX)
Intel® OS Guard
Intel® Secure Key technology
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Secure Boot
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Fused Multiply-Add (FMA)
Intel® Advanced Vector Extensions (AVX)
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
AMD Virtualization (AMD-V™)