Intel Core 2 Duo E6700 vs AMD Sempron LE-1200

Comparative analysis of Intel Core 2 Duo E6700 and AMD Sempron LE-1200 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core 2 Duo E6700

AMD Sempron LE-1200

Differences

Reasons to consider the Intel Core 2 Duo E6700

1 more cores, run more applications at once: 2 vs 1
Around 86% better performance in PassMark - Single thread mark: 1023 vs 551
2.8x better performance in PassMark - CPU mark: 990 vs 349

Specifications (specs)
Number of cores	2 vs 1
Benchmarks
PassMark - Single thread mark	1023 vs 551
PassMark - CPU mark	990 vs 349

Reasons to consider the AMD Sempron LE-1200

Around 44% lower typical power consumption: 45 Watt vs 65 Watt
2.7x better performance in Geekbench 4 - Single Core: 842 vs 317
Around 48% better performance in Geekbench 4 - Multi-Core: 835 vs 564

Specifications (specs)
Thermal Design Power (TDP)	45 Watt vs 65 Watt
Benchmarks
Geekbench 4 - Single Core	842 vs 317
Geekbench 4 - Multi-Core	835 vs 564

Compare benchmarks

CPU 1: Intel Core 2 Duo E6700
CPU 2: AMD Sempron LE-1200

PassMark - Single thread mark

CPU 1

CPU 2

1023

551

PassMark - CPU mark

CPU 1

CPU 2

990

349

Geekbench 4 - Single Core

CPU 1

CPU 2

317

842

Geekbench 4 - Multi-Core

CPU 1

CPU 2

564

835

Name	Intel Core 2 Duo E6700	AMD Sempron LE-1200
PassMark - Single thread mark	1023	551
PassMark - CPU mark	990	349
Geekbench 4 - Single Core	317	842
Geekbench 4 - Multi-Core	564	835

Compare specifications (specs)

	Intel Core 2 Duo E6700	AMD Sempron LE-1200
Essentials
Architecture codename	Conroe	Sparta
Launch date	Q3'06	August 2007
Place in performance rating	2712	2710
Processor Number	E6700
Series	Legacy Intel® Core™ Processors
Status	Discontinued
Vertical segment	Desktop	Desktop
Performance
64 bit support
Base frequency	2.66 GHz
Bus Speed	1066 MHz FSB
Die size	143 mm2
Manufacturing process technology	65 nm	65 nm
Maximum core temperature	60.1°C
Number of cores	2	1
Transistor count	291 million
VID voltage range	0.8500V-1.5V
L1 cache		128 KB
L2 cache		512 KB
Maximum frequency		2.1 GHz
Compatibility
Low Halogen Options Available
Package Size	37.5mm x 37.5mm
Scenario Design Power (SDP)	0 W
Sockets supported	PLGA775	AM2
Thermal Design Power (TDP)	65 Watt	45 Watt
Max number of CPUs in a configuration		1
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)