Intel Core 2 Duo E6700 vs AMD Sempron LE-1200
Comparative analysis of Intel Core 2 Duo E6700 and AMD Sempron LE-1200 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core 2 Duo E6700
- 1 more cores, run more applications at once: 2 vs 1
- Around 86% better performance in PassMark - Single thread mark: 1023 vs 551
- 2.8x better performance in PassMark - CPU mark: 990 vs 349
Specifications (specs) | |
Number of cores | 2 vs 1 |
Benchmarks | |
PassMark - Single thread mark | 1023 vs 551 |
PassMark - CPU mark | 990 vs 349 |
Reasons to consider the AMD Sempron LE-1200
- Around 44% lower typical power consumption: 45 Watt vs 65 Watt
- 2.7x better performance in Geekbench 4 - Single Core: 842 vs 317
- Around 48% better performance in Geekbench 4 - Multi-Core: 835 vs 564
Specifications (specs) | |
Thermal Design Power (TDP) | 45 Watt vs 65 Watt |
Benchmarks | |
Geekbench 4 - Single Core | 842 vs 317 |
Geekbench 4 - Multi-Core | 835 vs 564 |
Compare benchmarks
CPU 1: Intel Core 2 Duo E6700
CPU 2: AMD Sempron LE-1200
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Core 2 Duo E6700 | AMD Sempron LE-1200 |
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PassMark - Single thread mark | 1023 | 551 |
PassMark - CPU mark | 990 | 349 |
Geekbench 4 - Single Core | 317 | 842 |
Geekbench 4 - Multi-Core | 564 | 835 |
Compare specifications (specs)
Intel Core 2 Duo E6700 | AMD Sempron LE-1200 | |
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Essentials |
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Architecture codename | Conroe | Sparta |
Launch date | Q3'06 | August 2007 |
Place in performance rating | 2702 | 2700 |
Processor Number | E6700 | |
Series | Legacy Intel® Core™ Processors | |
Status | Discontinued | |
Vertical segment | Desktop | Desktop |
Performance |
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64 bit support | ||
Base frequency | 2.66 GHz | |
Bus Speed | 1066 MHz FSB | |
Die size | 143 mm2 | |
Manufacturing process technology | 65 nm | 65 nm |
Maximum core temperature | 60.1°C | |
Number of cores | 2 | 1 |
Transistor count | 291 million | |
VID voltage range | 0.8500V-1.5V | |
L1 cache | 128 KB | |
L2 cache | 512 KB | |
Maximum frequency | 2.1 GHz | |
Compatibility |
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Low Halogen Options Available | ||
Package Size | 37.5mm x 37.5mm | |
Scenario Design Power (SDP) | 0 W | |
Sockets supported | PLGA775 | AM2 |
Thermal Design Power (TDP) | 65 Watt | 45 Watt |
Max number of CPUs in a configuration | 1 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) |