Intel Core 2 Duo E6700 vs AMD Sempron LE-1200

Comparative analysis of Intel Core 2 Duo E6700 and AMD Sempron LE-1200 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Core 2 Duo E6700

  • 1 more cores, run more applications at once: 2 vs 1
  • Around 86% better performance in PassMark - Single thread mark: 1023 vs 551
  • 2.8x better performance in PassMark - CPU mark: 990 vs 349
Specifications (specs)
Number of cores 2 vs 1
Benchmarks
PassMark - Single thread mark 1023 vs 551
PassMark - CPU mark 990 vs 349

Reasons to consider the AMD Sempron LE-1200

  • Around 44% lower typical power consumption: 45 Watt vs 65 Watt
  • 2.7x better performance in Geekbench 4 - Single Core: 842 vs 317
  • Around 48% better performance in Geekbench 4 - Multi-Core: 835 vs 564
Specifications (specs)
Thermal Design Power (TDP) 45 Watt vs 65 Watt
Benchmarks
Geekbench 4 - Single Core 842 vs 317
Geekbench 4 - Multi-Core 835 vs 564

Compare benchmarks

CPU 1: Intel Core 2 Duo E6700
CPU 2: AMD Sempron LE-1200

PassMark - Single thread mark
CPU 1
CPU 2
1023
551
PassMark - CPU mark
CPU 1
CPU 2
990
349
Geekbench 4 - Single Core
CPU 1
CPU 2
317
842
Geekbench 4 - Multi-Core
CPU 1
CPU 2
564
835
Name Intel Core 2 Duo E6700 AMD Sempron LE-1200
PassMark - Single thread mark 1023 551
PassMark - CPU mark 990 349
Geekbench 4 - Single Core 317 842
Geekbench 4 - Multi-Core 564 835

Compare specifications (specs)

Intel Core 2 Duo E6700 AMD Sempron LE-1200

Essentials

Architecture codename Conroe Sparta
Launch date Q3'06 August 2007
Place in performance rating 2702 2700
Processor Number E6700
Series Legacy Intel® Core™ Processors
Status Discontinued
Vertical segment Desktop Desktop

Performance

64 bit support
Base frequency 2.66 GHz
Bus Speed 1066 MHz FSB
Die size 143 mm2
Manufacturing process technology 65 nm 65 nm
Maximum core temperature 60.1°C
Number of cores 2 1
Transistor count 291 million
VID voltage range 0.8500V-1.5V
L1 cache 128 KB
L2 cache 512 KB
Maximum frequency 2.1 GHz

Compatibility

Low Halogen Options Available
Package Size 37.5mm x 37.5mm
Scenario Design Power (SDP) 0 W
Sockets supported PLGA775 AM2
Thermal Design Power (TDP) 65 Watt 45 Watt
Max number of CPUs in a configuration 1

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)