Intel Core 2 Duo E6700 vs Intel Core i3-560
Comparative analysis of Intel Core 2 Duo E6700 and Intel Core i3-560 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s).
Differences
Reasons to consider the Intel Core 2 Duo E6700
- Around 12% lower typical power consumption: 65 Watt vs 73 Watt
| Thermal Design Power (TDP) | 65 Watt vs 73 Watt |
Reasons to consider the Intel Core i3-560
- Around 21% higher maximum core temperature: 72.6°C vs 60.1°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
- Around 32% better performance in PassMark - Single thread mark: 1352 vs 1023
- Around 64% better performance in PassMark - CPU mark: 1627 vs 990
- Around 71% better performance in Geekbench 4 - Single Core: 542 vs 317
- 2.1x better performance in Geekbench 4 - Multi-Core: 1200 vs 564
| Specifications (specs) | |
| Maximum core temperature | 72.6°C vs 60.1°C |
| Manufacturing process technology | 32 nm vs 65 nm |
| Benchmarks | |
| PassMark - Single thread mark | 1352 vs 1023 |
| PassMark - CPU mark | 1627 vs 990 |
| Geekbench 4 - Single Core | 542 vs 317 |
| Geekbench 4 - Multi-Core | 1200 vs 564 |
Compare benchmarks
CPU 1: Intel Core 2 Duo E6700
CPU 2: Intel Core i3-560
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Geekbench 4 - Single Core |
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| Geekbench 4 - Multi-Core |
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| Name | Intel Core 2 Duo E6700 | Intel Core i3-560 |
|---|---|---|
| PassMark - Single thread mark | 1023 | 1352 |
| PassMark - CPU mark | 990 | 1627 |
| Geekbench 4 - Single Core | 317 | 542 |
| Geekbench 4 - Multi-Core | 564 | 1200 |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 0.611 | |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 32.532 | |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.174 |
Compare specifications (specs)
| Intel Core 2 Duo E6700 | Intel Core i3-560 | |
|---|---|---|
Essentials |
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| Architecture codename | Conroe | Clarkdale |
| Launch date | Q3'06 | August 2010 |
| Place in performance rating | 2712 | 2723 |
| Processor Number | E6700 | i3-560 |
| Series | Legacy Intel® Core™ Processors | Legacy Intel® Core™ Processors |
| Status | Discontinued | Discontinued |
| Vertical segment | Desktop | Desktop |
| Launch price (MSRP) | $190 | |
| Price now | $29.98 | |
| Value for money (0-100) | 28.90 | |
Performance |
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| 64 bit support | ||
| Base frequency | 2.66 GHz | 3.33 GHz |
| Bus Speed | 1066 MHz FSB | 2.5 GT/s DMI |
| Die size | 143 mm2 | 81 mm2 |
| Manufacturing process technology | 65 nm | 32 nm |
| Maximum core temperature | 60.1°C | 72.6°C |
| Number of cores | 2 | 2 |
| Transistor count | 291 million | 382 million |
| VID voltage range | 0.8500V-1.5V | 0.6500V-1.4000V |
| L1 cache | 64 KB (per core) | |
| L2 cache | 256 KB (per core) | |
| L3 cache | 4096 KB (shared) | |
| Maximum frequency | 3.33 GHz | |
| Number of threads | 4 | |
Compatibility |
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| Low Halogen Options Available | ||
| Package Size | 37.5mm x 37.5mm | 37.5mm x 37.5mm |
| Scenario Design Power (SDP) | 0 W | |
| Sockets supported | PLGA775 | FCLGA1156 |
| Thermal Design Power (TDP) | 65 Watt | 73 Watt |
| Max number of CPUs in a configuration | 1 | |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Idle States | ||
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Thermal Monitoring | ||
| Flexible Display interface (FDI) | ||
| Instruction set extensions | Intel® SSE4.2 | |
| Intel® vPro™ Platform Eligibility | ||
| Physical Address Extensions (PAE) | 36-bit | |
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
Memory |
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| Max memory channels | 2 | |
| Maximum memory bandwidth | 21 GB/s | |
| Maximum memory size | 16.38 GB | |
| Supported memory types | DDR3 1066/1333 | |
Graphics |
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| Graphics base frequency | 733 MHz | |
| Intel® Clear Video HD technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Processor graphics | Intel HD Graphics | |
Graphics interfaces |
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| Number of displays supported | 2 | |
Peripherals |
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| Max number of PCIe lanes | 16 | |
| PCI Express revision | 2.0 | |
| PCIe configurations | 1x16, 2x8 | |
