Intel Core 2 Duo E6700 vs Intel Pentium Gold G5620

Comparative analysis of Intel Core 2 Duo E6700 and Intel Pentium Gold G5620 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Pentium Gold G5620

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 65 nm
  • Around 27% lower typical power consumption: 51 Watt vs 65 Watt
  • 2.4x better performance in PassMark - Single thread mark: 2461 vs 1023
  • 4.3x better performance in PassMark - CPU mark: 4272 vs 990
Specifications (specs)
Manufacturing process technology 14 nm vs 65 nm
Thermal Design Power (TDP) 51 Watt vs 65 Watt
Benchmarks
PassMark - Single thread mark 2461 vs 1023
PassMark - CPU mark 4272 vs 990

Compare benchmarks

CPU 1: Intel Core 2 Duo E6700
CPU 2: Intel Pentium Gold G5620

PassMark - Single thread mark
CPU 1
CPU 2
1023
2461
PassMark - CPU mark
CPU 1
CPU 2
990
4272
Name Intel Core 2 Duo E6700 Intel Pentium Gold G5620
PassMark - Single thread mark 1023 2461
PassMark - CPU mark 990 4272
Geekbench 4 - Single Core 317
Geekbench 4 - Multi-Core 564

Compare specifications (specs)

Intel Core 2 Duo E6700 Intel Pentium Gold G5620

Essentials

Architecture codename Conroe Coffee Lake
Launch date Q3'06 February 2019
Place in performance rating 2712 1033
Processor Number E6700
Series Legacy Intel® Core™ Processors
Status Discontinued
Vertical segment Desktop Desktop

Performance

64 bit support
Base frequency 2.66 GHz
Bus Speed 1066 MHz FSB
Die size 143 mm2
Manufacturing process technology 65 nm 14 nm
Maximum core temperature 60.1°C
Number of cores 2 2
Transistor count 291 million
VID voltage range 0.8500V-1.5V
L1 cache 64K (per core)
L2 cache 256K (per core)
L3 cache 4 MB (shared)
Maximum case temperature (TCase) 72 °C
Maximum frequency 4 GHz

Compatibility

Low Halogen Options Available
Package Size 37.5mm x 37.5mm
Scenario Design Power (SDP) 0 W
Sockets supported PLGA775 1151
Thermal Design Power (TDP) 65 Watt 51 Watt
Max number of CPUs in a configuration 1

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
Intel® Advanced Vector Extensions (AVX)

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)

Memory

Maximum memory size 64 GB
Supported memory frequency 2400 MHz
Supported memory types DDR4

Graphics

Execution Units 24
Processor graphics Intel HD Graphics 630