Intel Core 2 Duo E6850 vs Intel Core 2 Extreme QX9650
Comparative analysis of Intel Core 2 Duo E6850 and Intel Core 2 Extreme QX9650 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the Intel Core 2 Duo E6850
- Around 12% higher maximum core temperature: 72°C vs 64.5°C
- 2x lower typical power consumption: 65 Watt vs 130 Watt
Maximum core temperature | 72°C vs 64.5°C |
Thermal Design Power (TDP) | 65 Watt vs 130 Watt |
Reasons to consider the Intel Core 2 Extreme QX9650
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- 2 more cores, run more applications at once: 4 vs 2
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
- Around 16% better performance in Geekbench 4 - Single Core: 465 vs 401
- 2.1x better performance in Geekbench 4 - Multi-Core: 1463 vs 702
Specifications (specs) | |
Unlocked | Unlocked vs Locked |
Number of cores | 4 vs 2 |
Manufacturing process technology | 45 nm vs 65 nm |
Benchmarks | |
Geekbench 4 - Single Core | 465 vs 401 |
Geekbench 4 - Multi-Core | 1463 vs 702 |
Compare benchmarks
CPU 1: Intel Core 2 Duo E6850
CPU 2: Intel Core 2 Extreme QX9650
Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Core 2 Duo E6850 | Intel Core 2 Extreme QX9650 |
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PassMark - Single thread mark | 1183 | |
PassMark - CPU mark | 1130 | |
Geekbench 4 - Single Core | 401 | 465 |
Geekbench 4 - Multi-Core | 702 | 1463 |
3DMark Fire Strike - Physics Score | 4864 |
Compare specifications (specs)
Intel Core 2 Duo E6850 | Intel Core 2 Extreme QX9650 | |
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Essentials |
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Architecture codename | Conroe | Yorkfield |
Launch date | Q3'07 | November 2007 |
Place in performance rating | 2538 | 2536 |
Processor Number | E6850 | QX9650 |
Series | Legacy Intel® Core™ Processors | Legacy Intel® Core™ Processors |
Status | Discontinued | Discontinued |
Vertical segment | Desktop | Desktop |
Performance |
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64 bit support | ||
Base frequency | 3.00 GHz | 3.00 GHz |
Bus Speed | 1333 MHz FSB | 1333 MHz FSB |
Die size | 143 mm2 | 214 mm2 |
Manufacturing process technology | 65 nm | 45 nm |
Maximum core temperature | 72°C | 64.5°C |
Number of cores | 2 | 4 |
Transistor count | 291 million | 820 million |
VID voltage range | 0.8500V-1.5V | 0.8500V-1.3625V |
L1 cache | 256 KB | |
L2 cache | 12288 KB | |
Maximum case temperature (TCase) | 64 °C | |
Maximum frequency | 3 GHz | |
Unlocked | ||
Compatibility |
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Low Halogen Options Available | ||
Package Size | 37.5mm x 37.5mm | 37.5mm x 37.5mm |
Sockets supported | PLGA775 | LGA775 |
Thermal Design Power (TDP) | 65 Watt | 130 Watt |
Max number of CPUs in a configuration | 1 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Memory |
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Supported memory types | DDR1, DDR2, DDR3 |