Intel Core 2 Duo E6850 vs Intel Pentium 4 HT 620

Comparative analysis of Intel Core 2 Duo E6850 and Intel Pentium 4 HT 620 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core 2 Duo E6850

Intel Pentium 4 HT 620

Differences

Reasons to consider the Intel Core 2 Duo E6850

1 more cores, run more applications at once: 2 vs 1
Around 6% higher maximum core temperature: 72°C vs 67.7°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
Around 29% lower typical power consumption: 65 Watt vs 84 Watt

Number of cores	2 vs 1
Maximum core temperature	72°C vs 67.7°C
Manufacturing process technology	65 nm vs 90 nm
Thermal Design Power (TDP)	65 Watt vs 84 Watt

Reasons to consider the Intel Pentium 4 HT 620

2x better performance in Geekbench 4 - Single Core: 801 vs 401
Around 29% better performance in Geekbench 4 - Multi-Core: 906 vs 702

Benchmarks
Geekbench 4 - Single Core	801 vs 401
Geekbench 4 - Multi-Core	906 vs 702

Compare benchmarks

CPU 1: Intel Core 2 Duo E6850
CPU 2: Intel Pentium 4 HT 620

Geekbench 4 - Single Core

CPU 1

CPU 2

401

801

Geekbench 4 - Multi-Core

CPU 1

CPU 2

702

906

Name	Intel Core 2 Duo E6850	Intel Pentium 4 HT 620
PassMark - Single thread mark	1188
PassMark - CPU mark	1154
Geekbench 4 - Single Core	401	801
Geekbench 4 - Multi-Core	702	906

Compare specifications (specs)

	Intel Core 2 Duo E6850	Intel Pentium 4 HT 620
Essentials
Architecture codename	Conroe	Prescott
Launch date	Q3'07	February 2005
Place in performance rating	2528	2526
Processor Number	E6850	620
Series	Legacy Intel® Core™ Processors	Legacy Intel® Pentium® Processor
Status	Discontinued	Discontinued
Vertical segment	Desktop	Desktop
Performance
64 bit support
Base frequency	3.00 GHz	2.80 GHz
Bus Speed	1333 MHz FSB	800 MHz FSB
Die size	143 mm2	135 mm2
Manufacturing process technology	65 nm	90 nm
Maximum core temperature	72°C	67.7°C
Number of cores	2	1
Transistor count	291 million	169 million
VID voltage range	0.8500V-1.5V	1.200V-1.400V
L1 cache		28 KB
L2 cache		2048 KB
Maximum case temperature (TCase)		68 °C
Maximum frequency		2.8 GHz
Compatibility
Low Halogen Options Available
Package Size	37.5mm x 37.5mm
Sockets supported	PLGA775	PLGA775
Thermal Design Power (TDP)	65 Watt	84 Watt
Max number of CPUs in a configuration		1
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Memory
Supported memory types		DDR1, DDR2, DDR3