Intel Core 2 Duo L7400 vs Intel Xeon W-2123

Comparative analysis of Intel Core 2 Duo L7400 and Intel Xeon W-2123 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core 2 Duo L7400

Intel Xeon W-2123

Differences

Reasons to consider the Intel Core 2 Duo L7400

Around 54% higher maximum core temperature: 100°C vs 65
7.1x lower typical power consumption: 17 Watt vs 120 Watt

Maximum core temperature	100°C vs 65
Thermal Design Power (TDP)	17 Watt vs 120 Watt

Reasons to consider the Intel Xeon W-2123

2 more cores, run more applications at once: 4 vs 2
A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 65 nm
3.9x better performance in PassMark - Single thread mark: 2186 vs 555
16.5x better performance in PassMark - CPU mark: 8496 vs 516

Specifications (specs)
Number of cores	4 vs 2
Manufacturing process technology	14 nm vs 65 nm
Benchmarks
PassMark - Single thread mark	2186 vs 555
PassMark - CPU mark	8496 vs 516

Compare benchmarks

CPU 1: Intel Core 2 Duo L7400
CPU 2: Intel Xeon W-2123

PassMark - Single thread mark

CPU 1

CPU 2

555

2186

PassMark - CPU mark

CPU 1

CPU 2

516

8496

Name	Intel Core 2 Duo L7400	Intel Xeon W-2123
PassMark - Single thread mark	555	2186
PassMark - CPU mark	516	8496
Geekbench 4 - Single Core		952
Geekbench 4 - Multi-Core		4082

Compare specifications (specs)

	Intel Core 2 Duo L7400	Intel Xeon W-2123
Essentials
Architecture codename	Merom	Skylake
Launch date	Q3'06	Q3'17
Place in performance rating	2897	1426
Processor Number	L7400	W-2123
Series	Legacy Intel® Core™ Processors	Intel® Xeon® W Processor
Status	Discontinued	Launched
Vertical segment	Mobile	Server
Performance
64 bit support
Base frequency	1.50 GHz	3.60 GHz
Bus Speed	667 MHz FSB	0 GT/s QPI
Die size	143 mm2
Manufacturing process technology	65 nm	14 nm
Maximum core temperature	100°C	65
Number of cores	2	4
Transistor count	291 million
VID voltage range	0.9V-1.1V
Maximum frequency		3.90 GHz
Number of QPI Links		0
Number of threads		8
Number of Ultra Path Interconnect (UPI) Links		0
Compatibility
Low Halogen Options Available
Package Size	35mm x 35mm	45mm x 52.5mm
Sockets supported	PBGA479	FCLGA2066
Thermal Design Power (TDP)	17 Watt	120 Watt
Max number of CPUs in a configuration		1
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Intel® Identity Protection technology
Intel® Memory Protection Extensions (Intel® MPX)
Intel® OS Guard
Intel® Secure Key technology
Intel® Software Guard Extensions (Intel® SGX)
Secure Boot
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Instruction set extensions		Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512
Intel® AES New Instructions
Intel® Flex Memory Access
Intel® Optane™ Memory Supported
Intel® TSX-NI
Intel® Volume Management Device (VMD)
Intel® vPro™ Platform Eligibility
Number of AVX-512 FMA Units		2
Physical Address Extensions (PAE)		46-bit
Speed Shift technology
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
Memory
Max memory channels		4
Maximum memory bandwidth		85.3 GB/s
Maximum memory size		512 GB
Supported memory types		DDR4 1600/1866/2133/2400/2666
Peripherals
Max number of PCIe lanes		48
PCI Express revision		3.0
PCIe configurations		x4, x8, x16
Scalability		1S Only