Intel Core 2 Duo SU7300 vs AMD Mobile Sempron 200U
Comparative analysis of Intel Core 2 Duo SU7300 and AMD Mobile Sempron 200U processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Core 2 Duo SU7300
- CPU is newer: launch date 7 month(s) later
- 1 more cores, run more applications at once: 2 vs 1
- 1 more threads: 2 vs 1
- Around 30% higher clock speed: 1.3 GHz vs 1 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
- 12x more L2 cache, more data can be stored in the L2 cache for quick access later
Launch date | 1 September 2009 vs 16 January 2009 |
Number of cores | 2 vs 1 |
Number of threads | 2 vs 1 |
Maximum frequency | 1.3 GHz vs 1 GHz |
Manufacturing process technology | 45 nm vs 65 nm |
L2 cache | 3 MB vs 256 KB |
Reasons to consider the AMD Mobile Sempron 200U
- Around 25% lower typical power consumption: 8 Watt vs 10 Watt
Thermal Design Power (TDP) | 8 Watt vs 10 Watt |
Compare benchmarks
CPU 1: Intel Core 2 Duo SU7300
CPU 2: AMD Mobile Sempron 200U
Name | Intel Core 2 Duo SU7300 | AMD Mobile Sempron 200U |
---|---|---|
Geekbench 4 - Single Core | 177 | |
Geekbench 4 - Multi-Core | 309 | |
PassMark - Single thread mark | 311 | |
PassMark - CPU mark | 125 |
Compare specifications (specs)
Intel Core 2 Duo SU7300 | AMD Mobile Sempron 200U | |
---|---|---|
Essentials |
||
Architecture codename | Penryn | Huron |
Launch date | 1 September 2009 | 16 January 2009 |
Place in performance rating | 3290 | 3238 |
Series | Intel Core 2 Duo | AMD Mobile Sempron |
Vertical segment | Laptop | Laptop |
Performance |
||
64 bit support | ||
Die size | 107 mm | |
Front-side bus (FSB) | 800 MHz | 1600 MHz |
L2 cache | 3 MB | 256 KB |
Manufacturing process technology | 45 nm | 65 nm |
Maximum frequency | 1.3 GHz | 1 GHz |
Number of cores | 2 | 1 |
Number of threads | 2 | 1 |
Transistor count | 410 Million | |
Compatibility |
||
Sockets supported | BGA956 | ASB1 |
Thermal Design Power (TDP) | 10 Watt | 8 Watt |
Security & Reliability |
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Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) |