Intel Core 2 Duo SU7300 vs AMD Mobile Sempron 200U

Comparative analysis of Intel Core 2 Duo SU7300 and AMD Mobile Sempron 200U processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the Intel Core 2 Duo SU7300

  • CPU is newer: launch date 7 month(s) later
  • 1 more cores, run more applications at once: 2 vs 1
  • 1 more threads: 2 vs 1
  • Around 30% higher clock speed: 1.3 GHz vs 1 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
  • 12x more L2 cache, more data can be stored in the L2 cache for quick access later
Launch date 1 September 2009 vs 16 January 2009
Number of cores 2 vs 1
Number of threads 2 vs 1
Maximum frequency 1.3 GHz vs 1 GHz
Manufacturing process technology 45 nm vs 65 nm
L2 cache 3 MB vs 256 KB

Reasons to consider the AMD Mobile Sempron 200U

  • Around 25% lower typical power consumption: 8 Watt vs 10 Watt
Thermal Design Power (TDP) 8 Watt vs 10 Watt

Compare benchmarks

CPU 1: Intel Core 2 Duo SU7300
CPU 2: AMD Mobile Sempron 200U

Name Intel Core 2 Duo SU7300 AMD Mobile Sempron 200U
Geekbench 4 - Single Core 177
Geekbench 4 - Multi-Core 309
PassMark - Single thread mark 311
PassMark - CPU mark 125

Compare specifications (specs)

Intel Core 2 Duo SU7300 AMD Mobile Sempron 200U

Essentials

Architecture codename Penryn Huron
Launch date 1 September 2009 16 January 2009
Place in performance rating 3290 3238
Series Intel Core 2 Duo AMD Mobile Sempron
Vertical segment Laptop Laptop

Performance

64 bit support
Die size 107 mm
Front-side bus (FSB) 800 MHz 1600 MHz
L2 cache 3 MB 256 KB
Manufacturing process technology 45 nm 65 nm
Maximum frequency 1.3 GHz 1 GHz
Number of cores 2 1
Number of threads 2 1
Transistor count 410 Million

Compatibility

Sockets supported BGA956 ASB1
Thermal Design Power (TDP) 10 Watt 8 Watt

Security & Reliability

Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology

Virtualization

Intel® Virtualization Technology (VT-x)