Intel Atom E660 vs Intel Core 2 Duo SU7300
Comparative analysis of Intel Atom E660 and Intel Core 2 Duo SU7300 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Atom E660
- CPU is newer: launch date 1 year(s) 0 month(s) later
- 2.5x lower typical power consumption: 3.6 Watt vs 10 Watt
Launch date | September 2010 vs 1 September 2009 |
Thermal Design Power (TDP) | 3.6 Watt vs 10 Watt |
Reasons to consider the Intel Core 2 Duo SU7300
- 1 more cores, run more applications at once: 2 vs 1
- 6x more L2 cache, more data can be stored in the L2 cache for quick access later
Number of cores | 2 vs 1 |
L2 cache | 3 MB vs 512 KB (per core) |
Compare benchmarks
CPU 1: Intel Atom E660
CPU 2: Intel Core 2 Duo SU7300
Name | Intel Atom E660 | Intel Core 2 Duo SU7300 |
---|---|---|
PassMark - Single thread mark | 0 | |
PassMark - CPU mark | 271 | |
Geekbench 4 - Single Core | 177 | |
Geekbench 4 - Multi-Core | 309 |
Compare specifications (specs)
Intel Atom E660 | Intel Core 2 Duo SU7300 | |
---|---|---|
Essentials |
||
Architecture codename | Tunnel Creek | Penryn |
Launch date | September 2010 | 1 September 2009 |
Launch price (MSRP) | $54 | |
Place in performance rating | 3334 | 3290 |
Price now | $54 | |
Processor Number | E660 | |
Series | Legacy Intel Atom® Processors | Intel Core 2 Duo |
Status | Launched | |
Value for money (0-100) | 1.48 | |
Vertical segment | Embedded | Laptop |
Performance |
||
Base frequency | 1.30 GHz | |
Bus Speed | 2500 MHz PCIE | |
Die size | 26 mm | 107 mm |
L1 cache | 64 KB (per core) | |
L2 cache | 512 KB (per core) | 3 MB |
Manufacturing process technology | 45 nm | 45 nm |
Maximum core temperature | 90°C | |
Maximum frequency | 1.3 GHz | 1.3 GHz |
Number of cores | 1 | 2 |
Number of threads | 2 | 2 |
Transistor count | 47 million | 410 Million |
VID voltage range | VCC (0.75 - 0.9V), VNN (0.75 - 1.1V) | |
64 bit support | ||
Front-side bus (FSB) | 800 MHz | |
Memory |
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Max memory channels | 1 | |
Maximum memory size | 2 GB | |
Supported memory types | DDR2 800 | |
Graphics |
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Graphics base frequency | 400 MHz | |
Processor graphics | Integrated | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | 22mmx22mm | |
Sockets supported | FCBGA676 | BGA956 |
Thermal Design Power (TDP) | 3.6 Watt | 10 Watt |
Peripherals |
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Max number of PCIe lanes | 4 | |
PCI Express revision | 1.0a | |
PCIe configurations | x1, root complex only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) |