Intel Core 2 Duo T5300 vs Intel Core i3-2310E

Comparative analysis of Intel Core 2 Duo T5300 and Intel Core i3-2310E processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core 2 Duo T5300

Intel Core i3-2310E

Differences

Reasons to consider the Intel Core 2 Duo T5300

Around 3% lower typical power consumption: 34 Watt vs 35 Watt

Thermal Design Power (TDP)	34 Watt vs 35 Watt

Reasons to consider the Intel Core i3-2310E

A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
Around 38% better performance in PassMark - Single thread mark: 733 vs 533
3.5x better performance in PassMark - CPU mark: 1845 vs 530

Specifications (specs)
Manufacturing process technology	32 nm vs 65 nm
Benchmarks
PassMark - Single thread mark	733 vs 533
PassMark - CPU mark	1845 vs 530

Compare benchmarks

CPU 1: Intel Core 2 Duo T5300
CPU 2: Intel Core i3-2310E

PassMark - Single thread mark

CPU 1

CPU 2

533

733

PassMark - CPU mark

CPU 1

CPU 2

530

1845

Name	Intel Core 2 Duo T5300	Intel Core i3-2310E
PassMark - Single thread mark	533	733
PassMark - CPU mark	530	1845
Geekbench 4 - Single Core	918
Geekbench 4 - Multi-Core	1412

Compare specifications (specs)

	Intel Core 2 Duo T5300	Intel Core i3-2310E
Essentials
Architecture codename	Merom	Sandy Bridge
Place in performance rating	2601	2605
Processor Number	T5300	i3-2310E
Series	Legacy Intel® Core™ Processors	Legacy Intel® Core™ Processors
Status	Discontinued	Launched
Vertical segment	Mobile	Embedded
Launch date		February 2011
Launch price (MSRP)		$225
Price now		$225
Value for money (0-100)		3.72
Performance
64 bit support
Base frequency	1.73 GHz	2.10 GHz
Bus Speed	533 MHz FSB
Die size	143 mm2	149 mm
Manufacturing process technology	65 nm	32 nm
Maximum core temperature	100°C	100C (BGA)
Number of cores	2	2
Transistor count	291 million	624 million
L1 cache		64 KB (per core)
L2 cache		256 KB (per core)
L3 cache		3072 KB (shared)
Maximum frequency		2.1 GHz
Number of threads		4
Compatibility
Low Halogen Options Available
Package Size	35mm x 35mm	31mm x 24mm (BGA1023)
Sockets supported	PPGA478	FCBGA1023
Thermal Design Power (TDP)	34 Watt	35 Watt
Max number of CPUs in a configuration		1
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Anti-Theft technology
Intel® Identity Protection technology
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
4G WiMAX Wireless
Flexible Display interface (FDI)
Idle States
Instruction set extensions		Intel® AVX
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® My WiFi technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
Memory
ECC memory support
Max memory channels		2
Maximum memory bandwidth		21.3 GB/s
Maximum memory size		16.6 GB
Supported memory types		DDR3 1066/1333
Graphics
Graphics base frequency		650 MHz
Graphics max dynamic frequency		1.05 GHz
Graphics max frequency		1.05 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics		Intel® HD Graphics 3000
Graphics interfaces
CRT
DisplayPort
eDP
HDMI
Number of displays supported		2
SDVO
Wireless Display (WiDi) support
Peripherals
Max number of PCIe lanes		16
PCI Express revision		2.0
PCIe configurations		1x16, 2x8, 1x8+2x4