Intel Core 2 Duo T5300 vs Intel Celeron G1820TE

Comparative analysis of Intel Core 2 Duo T5300 and Intel Celeron G1820TE processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score.

Intel Core 2 Duo T5300

Intel Celeron G1820TE

Differences

Reasons to consider the Intel Core 2 Duo T5300

Around 3% lower typical power consumption: 34 Watt vs 35 Watt

Thermal Design Power (TDP)	34 Watt vs 35 Watt

Reasons to consider the Intel Celeron G1820TE

A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 65 nm
Around 83% better performance in PassMark - Single thread mark: 978 vs 533
Around 92% better performance in PassMark - CPU mark: 1020 vs 530

Specifications (specs)
Manufacturing process technology	22 nm vs 65 nm
Benchmarks
PassMark - Single thread mark	978 vs 533
PassMark - CPU mark	1020 vs 530

Compare benchmarks

CPU 1: Intel Core 2 Duo T5300
CPU 2: Intel Celeron G1820TE

PassMark - Single thread mark

CPU 1

CPU 2

533

978

PassMark - CPU mark

CPU 1

CPU 2

530

1020

Name	Intel Core 2 Duo T5300	Intel Celeron G1820TE
PassMark - Single thread mark	533	978
PassMark - CPU mark	530	1020
Geekbench 4 - Single Core	918
Geekbench 4 - Multi-Core	1412
3DMark Fire Strike - Physics Score		882

Compare specifications (specs)

	Intel Core 2 Duo T5300	Intel Celeron G1820TE
Essentials
Architecture codename	Merom	Haswell
Place in performance rating	2601	2604
Processor Number	T5300	G1820TE
Series	Legacy Intel® Core™ Processors	Intel® Celeron® Processor G Series
Status	Discontinued	Launched
Vertical segment	Mobile	Embedded
Launch date		December 2013
Performance
64 bit support
Base frequency	1.73 GHz	2.20 GHz
Bus Speed	533 MHz FSB	5 GT/s DMI2
Die size	143 mm2	177 mm
Manufacturing process technology	65 nm	22 nm
Maximum core temperature	100°C
Number of cores	2	2
Transistor count	291 million	1400 million
L1 cache		64 KB (per core)
L2 cache		256 KB (per core)
L3 cache		3072 KB (shared)
Maximum case temperature (TCase)		72 °C
Maximum frequency		2.2 GHz
Number of threads		2
Compatibility
Low Halogen Options Available
Package Size	35mm x 35mm	37.5mm x 37.5mm
Sockets supported	PPGA478	FCLGA1150
Thermal Design Power (TDP)	34 Watt	35 Watt
Max number of CPUs in a configuration		1
Thermal Solution		PCG 2013A
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Intel® Identity Protection technology
Intel® Secure Key technology
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions		Intel® SSE4.1, Intel® SSE4.2
Intel® AES New Instructions
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
Memory
ECC memory support
Max memory channels		2
Maximum memory bandwidth		21.3 GB/s
Maximum memory size		32 GB
Supported memory types		DDR3 1333
Graphics
Graphics base frequency		350 MHz
Graphics max dynamic frequency		1.00 GHz
Graphics max frequency		1 GHz
Intel® Flexible Display Interface (Intel® FDI)
Intel® Quick Sync Video
Max video memory		1.7 GB
Processor graphics		Intel HD Graphics
Graphics interfaces
DisplayPort
DVI
eDP
HDMI
Number of displays supported		3
VGA
Peripherals
Max number of PCIe lanes		16
PCI Express revision		Up to 3.0
PCIe configurations		Up to 1x16, 2x8, 1x8/2x4
Scalability		1S Only