Intel Core 2 Duo T5450 vs Intel Core i3-2310M
Comparative analysis of Intel Core 2 Duo T5450 and Intel Core i3-2310M processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Core 2 Duo T5450
- Around 18% higher maximum core temperature: 100°C vs 85C (PGA); 100C (BGA)
| Maximum core temperature | 100°C vs 85C (PGA); 100C (BGA) |
Reasons to consider the Intel Core i3-2310M
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
- Around 58% better performance in PassMark - Single thread mark: 943 vs 598
- 2.1x better performance in PassMark - CPU mark: 1219 vs 578
- Around 80% better performance in Geekbench 4 - Single Core: 365 vs 203
- 2.3x better performance in Geekbench 4 - Multi-Core: 814 vs 359
| Specifications (specs) | |
| Manufacturing process technology | 32 nm vs 65 nm |
| Benchmarks | |
| PassMark - Single thread mark | 943 vs 598 |
| PassMark - CPU mark | 1219 vs 578 |
| Geekbench 4 - Single Core | 365 vs 203 |
| Geekbench 4 - Multi-Core | 814 vs 359 |
Compare benchmarks
CPU 1: Intel Core 2 Duo T5450
CPU 2: Intel Core i3-2310M
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Geekbench 4 - Single Core |
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| Geekbench 4 - Multi-Core |
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| Name | Intel Core 2 Duo T5450 | Intel Core i3-2310M |
|---|---|---|
| PassMark - Single thread mark | 598 | 943 |
| PassMark - CPU mark | 578 | 1219 |
| Geekbench 4 - Single Core | 203 | 365 |
| Geekbench 4 - Multi-Core | 359 | 814 |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 1.332 | |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 22.999 | |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.176 | |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 0.636 | |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 1.516 |
Compare specifications (specs)
| Intel Core 2 Duo T5450 | Intel Core i3-2310M | |
|---|---|---|
Essentials |
||
| Architecture codename | Merom | Sandy Bridge |
| Place in performance rating | 3034 | 3037 |
| Processor Number | T5450 | i3-2310M |
| Series | Legacy Intel® Core™ Processors | Legacy Intel® Core™ Processors |
| Status | Discontinued | Launched |
| Vertical segment | Mobile | Mobile |
| Launch date | 20 February 2011 | |
| Launch price (MSRP) | $76 | |
| Price now | $38.81 | |
| Value for money (0-100) | 18.43 | |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.66 GHz | 2.10 GHz |
| Bus Speed | 667 MHz FSB | 5 GT/s DMI |
| Die size | 143 mm2 | 149 mm |
| Manufacturing process technology | 65 nm | 32 nm |
| Maximum core temperature | 100°C | 85C (PGA); 100C (BGA) |
| Number of cores | 2 | 2 |
| Transistor count | 291 million | 624 Million |
| VID voltage range | 1.075V-1.250V | |
| L1 cache | 128 KB | |
| L2 cache | 512 KB | |
| L3 cache | 3072 KB | |
| Maximum frequency | 2.1 GHz | |
| Number of threads | 4 | |
Compatibility |
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| Low Halogen Options Available | ||
| Package Size | 35mm x 35mm | 37.5mm x 37.5mm *rPGA988B); 31mm x 24mm (BGA1023) |
| Sockets supported | PPGA478 | FCBGA1023, PPGA988 |
| Thermal Design Power (TDP) | 35 Watt | 35 Watt |
| Max number of CPUs in a configuration | 1 | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Anti-Theft technology | ||
| Intel® Identity Protection technology | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Intel 64 | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| 4G WiMAX Wireless | ||
| Flexible Display interface (FDI) | ||
| Idle States | ||
| Instruction set extensions | Intel® AVX | |
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Intel® Fast Memory Access | ||
| Intel® Flex Memory Access | ||
| Intel® My WiFi technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| AMD Virtualization (AMD-V™) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
Memory |
||
| Max memory channels | 2 | |
| Maximum memory bandwidth | 21.3 GB/s | |
| Maximum memory size | 16 GB | |
| Supported memory types | DDR3 1066/1333 | |
Graphics |
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| Device ID | 0x116 | |
| Graphics base frequency | 650 MHz | |
| Graphics max dynamic frequency | 1.10 GHz | |
| Graphics max frequency | 1.1 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Processor graphics | Intel® HD Graphics 3000 | |
Graphics interfaces |
||
| CRT | ||
| DisplayPort | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 2 | |
| SDVO | ||
| Wireless Display (WiDi) support | ||
Peripherals |
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| Max number of PCIe lanes | 16 | |
| PCI Express revision | 2.0 | |
| PCIe configurations | 1x16, 2x8, 1x8+2x4 | |
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