Intel Core 2 Duo T5470 vs Intel Core i7-3555LE
Comparative analysis of Intel Core 2 Duo T5470 and Intel Core i7-3555LE processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the Intel Core i7-3555LE
- Around 5% higher maximum core temperature: 105°C vs 100°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 65 nm
- Around 40% lower typical power consumption: 25 Watt vs 35 Watt
- 2.1x better performance in PassMark - Single thread mark: 1336 vs 636
- 3.8x better performance in PassMark - CPU mark: 2238 vs 590
| Specifications (specs) | |
| Maximum core temperature | 105°C vs 100°C |
| Manufacturing process technology | 22 nm vs 65 nm |
| Thermal Design Power (TDP) | 25 Watt vs 35 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 1336 vs 636 |
| PassMark - CPU mark | 2238 vs 590 |
Compare benchmarks
CPU 1: Intel Core 2 Duo T5470
CPU 2: Intel Core i7-3555LE
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Core 2 Duo T5470 | Intel Core i7-3555LE |
|---|---|---|
| PassMark - Single thread mark | 636 | 1336 |
| PassMark - CPU mark | 590 | 2238 |
| Geekbench 4 - Single Core | 1096 | |
| Geekbench 4 - Multi-Core | 1671 | |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 3.857 | |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 5.584 | |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.274 | |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 1.253 | |
| GFXBench 4.0 - T-Rex (Frames) | 2328 | |
| GFXBench 4.0 - T-Rex (Fps) | 2328 |
Compare specifications (specs)
| Intel Core 2 Duo T5470 | Intel Core i7-3555LE | |
|---|---|---|
Essentials |
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| Architecture codename | Merom | Ivy Bridge |
| Place in performance rating | 2404 | 2396 |
| Processor Number | T5470 | i7-3555LE |
| Series | Legacy Intel® Core™ Processors | Legacy Intel® Core™ Processors |
| Status | Discontinued | Launched |
| Vertical segment | Mobile | Embedded |
| Launch date | June 2012 | |
Performance |
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| 64 bit support | ||
| Base frequency | 1.60 GHz | 2.50 GHz |
| Bus Speed | 800 MHz FSB | 5 GT/s DMI |
| Die size | 143 mm2 | 118 mm |
| Manufacturing process technology | 65 nm | 22 nm |
| Maximum core temperature | 100°C | 105°C |
| Number of cores | 2 | 2 |
| Transistor count | 291 million | |
| VID voltage range | 1.075V-1.250V | |
| L1 cache | 64 KB (per core) | |
| L2 cache | 256 KB (per core) | |
| L3 cache | 4096 KB (shared) | |
| Maximum frequency | 3.20 GHz | |
| Number of threads | 4 | |
Compatibility |
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| Low Halogen Options Available | ||
| Package Size | 35mm x 35mm | 31.0mm x 24.0mm |
| Sockets supported | PPGA478 | FCBGA1023 |
| Thermal Design Power (TDP) | 35 Watt | 25 Watt |
| Max number of CPUs in a configuration | 1 | |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Anti-Theft technology | ||
| Intel® Identity Protection technology | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Intel 64 | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| 4G WiMAX Wireless | ||
| Flexible Display interface (FDI) | ||
| Idle States | ||
| Instruction set extensions | Intel® AVX | |
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Intel® Fast Memory Access | ||
| Intel® Flex Memory Access | ||
| Intel® My WiFi technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
Memory |
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| ECC memory support | ||
| Max memory channels | 2 | |
| Maximum memory bandwidth | 25.6 GB/s | |
| Maximum memory size | 16 GB | |
| Supported memory types | DDR3/DDR3L 1333/1600 | |
Graphics |
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| Graphics base frequency | 550 MHz | |
| Graphics max dynamic frequency | 1.00 GHz | |
| Graphics max frequency | 1 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Processor graphics | Intel® HD Graphics 4000 | |
Graphics interfaces |
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| CRT | ||
| DisplayPort | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 3 | |
| SDVO | ||
| Wireless Display (WiDi) support | ||
Peripherals |
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| Max number of PCIe lanes | 16 | |
| PCI Express revision | 3.0 | |
| PCIe configurations | 1x16, 2x8, 1x8 2x4 | |
