Intel Core 2 Duo T5870 vs Intel Core Solo T1300

Comparative analysis of Intel Core 2 Duo T5870 and Intel Core Solo T1300 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core 2 Duo T5870

Intel Core Solo T1300

Differences

Reasons to consider the Intel Core 2 Duo T5870

CPU is newer: launch date 2 year(s) 8 month(s) later
1 more cores, run more applications at once: 2 vs 1
1 more threads: 2 vs 1
Around 20% higher clock speed: 2 GHz vs 1.66 GHz
Around 43% better performance in PassMark - Single thread mark: 740 vs 518
3.3x better performance in PassMark - CPU mark: 698 vs 210

Specifications (specs)
Launch date	1 October 2008 vs January 2006
Number of cores	2 vs 1
Number of threads	2 vs 1
Maximum frequency	2 GHz vs 1.66 GHz
Benchmarks
PassMark - Single thread mark	740 vs 518
PassMark - CPU mark	698 vs 210

Reasons to consider the Intel Core Solo T1300

Around 30% lower typical power consumption: 27 Watt vs 35 Watt

Thermal Design Power (TDP)	27 Watt vs 35 Watt

Compare benchmarks

CPU 1: Intel Core 2 Duo T5870
CPU 2: Intel Core Solo T1300

PassMark - Single thread mark

CPU 1

CPU 2

740

518

PassMark - CPU mark

CPU 1

CPU 2

698

210

Name	Intel Core 2 Duo T5870	Intel Core Solo T1300
PassMark - Single thread mark	740	518
PassMark - CPU mark	698	210
Geekbench 4 - Single Core	250
Geekbench 4 - Multi-Core	429

Compare specifications (specs)

	Intel Core 2 Duo T5870	Intel Core Solo T1300
Essentials
Architecture codename	Merom	Yonah
Launch date	1 October 2008	January 2006
Place in performance rating	2970	2975
Processor Number	T5870	T1300
Series	Legacy Intel® Core™ Processors	Legacy Intel® Core™ Processors
Status	Discontinued	Discontinued
Vertical segment	Mobile	Mobile
Performance
64 bit support
Base frequency	2.00 GHz	1.66 GHz
Bus Speed	800 MHz FSB	667 MHz FSB
Die size	143 mm2	90 mm2
Front-side bus (FSB)	800 MHz	667 MHz
L2 cache	2048 KB	2048 KB
Manufacturing process technology	65 nm	65 nm
Maximum core temperature	100°C	100°C
Maximum frequency	2 GHz	1.66 GHz
Number of cores	2	1
Number of threads	2	1
Transistor count	291 million	151 million
VID voltage range	1.075V-1.175V	1.1625V - 1.30V
L1 cache		64 KB
Compatibility
Low Halogen Options Available
Package Size	35mm x 35mm	35mm x 35mm
Thermal Design Power (TDP)	35 Watt	27 Watt
Max number of CPUs in a configuration		1
Scenario Design Power (SDP)		0 W
Sockets supported		PPGA478, PBGA479
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Idle States
Physical Address Extensions (PAE)		32-bit
Virtualization
Intel® Virtualization Technology (VT-x)
Memory
Supported memory types		DDR1