Intel Core 2 Duo T5870 vs Intel Pentium Dual Core T3400
Comparative analysis of Intel Core 2 Duo T5870 and Intel Pentium Dual Core T3400 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core 2 Duo T5870
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 5% better performance in PassMark - CPU mark: 698 vs 663
Specifications (specs) | |
L2 cache | 2048 KB vs 1024 KB |
Benchmarks | |
PassMark - Single thread mark | 740 vs 739 |
PassMark - CPU mark | 698 vs 663 |
Reasons to consider the Intel Pentium Dual Core T3400
- Around 8% higher clock speed: 2.16 GHz vs 2 GHz
- Around 4% better performance in Geekbench 4 - Multi-Core: 447 vs 429
Specifications (specs) | |
Maximum frequency | 2.16 GHz vs 2 GHz |
Benchmarks | |
Geekbench 4 - Single Core | 251 vs 250 |
Geekbench 4 - Multi-Core | 447 vs 429 |
Compare benchmarks
CPU 1: Intel Core 2 Duo T5870
CPU 2: Intel Pentium Dual Core T3400
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Core 2 Duo T5870 | Intel Pentium Dual Core T3400 |
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PassMark - Single thread mark | 740 | 739 |
PassMark - CPU mark | 698 | 663 |
Geekbench 4 - Single Core | 250 | 251 |
Geekbench 4 - Multi-Core | 429 | 447 |
Compare specifications (specs)
Intel Core 2 Duo T5870 | Intel Pentium Dual Core T3400 | |
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Essentials |
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Architecture codename | Merom | Merom |
Launch date | 1 October 2008 | 1 October 2008 |
Place in performance rating | 2970 | 2971 |
Processor Number | T5870 | T3400 |
Series | Legacy Intel® Core™ Processors | Legacy Intel® Pentium® Processor |
Status | Discontinued | Discontinued |
Vertical segment | Mobile | Mobile |
Performance |
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64 bit support | ||
Base frequency | 2.00 GHz | 2.16 GHz |
Bus Speed | 800 MHz FSB | 667 MHz FSB |
Die size | 143 mm2 | 143 mm2 |
Front-side bus (FSB) | 800 MHz | 667 MHz |
L2 cache | 2048 KB | 1024 KB |
Manufacturing process technology | 65 nm | 65 nm |
Maximum core temperature | 100°C | 100°C |
Maximum frequency | 2 GHz | 2.16 GHz |
Number of cores | 2 | 2 |
Number of threads | 2 | 2 |
Transistor count | 291 million | 291 million |
VID voltage range | 1.075V-1.175V | 1.075V-1.175V |
Compatibility |
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Low Halogen Options Available | ||
Package Size | 35mm x 35mm | |
Thermal Design Power (TDP) | 35 Watt | 35 Watt |
Sockets supported | PPGA478 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Idle States | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) |