Intel Core 2 Extreme QX6700 vs Intel Core i5-3340S

Comparative analysis of Intel Core 2 Extreme QX6700 and Intel Core i5-3340S processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core 2 Extreme QX6700

Intel Core i5-3340S

Differences

Reasons to consider the Intel Core i5-3340S

Around 7% higher maximum core temperature: 69.1°C vs 64.5°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 65 nm
2x lower typical power consumption: 65 Watt vs 130 Watt

Maximum core temperature	69.1°C vs 64.5°C
Manufacturing process technology	22 nm vs 65 nm
Thermal Design Power (TDP)	65 Watt vs 130 Watt

Compare benchmarks

CPU 1: Intel Core 2 Extreme QX6700
CPU 2: Intel Core i5-3340S

Name	Intel Core 2 Extreme QX6700	Intel Core i5-3340S
PassMark - Single thread mark		1752
PassMark - CPU mark		3914
Geekbench 4 - Single Core		666
Geekbench 4 - Multi-Core		2120

Compare specifications (specs)

	Intel Core 2 Extreme QX6700	Intel Core i5-3340S
Essentials
Architecture codename	Kentsfield	Ivy Bridge
Launch date	Q4'06	Q3'13
Place in performance rating	not rated	1820
Processor Number	QX6700	i5-3340S
Series	Legacy Intel® Core™ Processors	Legacy Intel® Core™ Processors
Status	Discontinued	Discontinued
Vertical segment	Desktop	Desktop
Performance
64 bit support
Base frequency	2.66 GHz	2.80 GHz
Bus Speed	1066 MHz FSB	5 GT/s DMI
Die size	286 mm2
Manufacturing process technology	65 nm	22 nm
Maximum core temperature	64.5°C	69.1°C
Number of cores	4	4
Transistor count	582 million
VID voltage range	0.8500V-1.500V
Maximum frequency		3.30 GHz
Number of threads		4
Compatibility
Low Halogen Options Available
Package Size	37.5mm x 37.5mm	37.5mm x 37.5mm
Sockets supported	LGA775	FCLGA1155
Thermal Design Power (TDP)	130 Watt	65 Watt
Max number of CPUs in a configuration		1
Thermal Solution		2011C
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Anti-Theft technology
Intel® Identity Protection technology
Intel® Secure Key technology
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
Instruction set extensions		Intel® SSE4.1, Intel® SSE4.2, Intel® AVX
Intel® My WiFi technology
Intel® TSX-NI
Intel® vPro™ Platform Eligibility
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
Memory
Max memory channels		2
Maximum memory bandwidth		25.6 GB/s
Maximum memory size		32 GB
Supported memory types		DDR3 1333/1600
Graphics
Device ID		0x152
Graphics base frequency		650 MHz
Graphics max dynamic frequency		1.05 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics		Intel® HD Graphics 2500
Graphics interfaces
Number of displays supported		3
Peripherals
PCI Express revision		3.0
PCIe configurations		up to 1x16, 2x8, 1x8 & 2x4