Intel Core 2 Extreme QX6700 vs Intel Core i3-3250T

Comparative analysis of Intel Core 2 Extreme QX6700 and Intel Core i3-3250T processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the Intel Core 2 Extreme QX6700

  • 2 more cores, run more applications at once: 4 vs 2
Number of cores 4 vs 2

Reasons to consider the Intel Core i3-3250T

  • Around 1% higher maximum core temperature: 65.0°C vs 64.5°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 65 nm
  • 3.7x lower typical power consumption: 35 Watt vs 130 Watt
Maximum core temperature 65.0°C vs 64.5°C
Manufacturing process technology 22 nm vs 65 nm
Thermal Design Power (TDP) 35 Watt vs 130 Watt

Compare benchmarks

CPU 1: Intel Core 2 Extreme QX6700
CPU 2: Intel Core i3-3250T

Name Intel Core 2 Extreme QX6700 Intel Core i3-3250T
PassMark - Single thread mark 1684
PassMark - CPU mark 2650

Compare specifications (specs)

Intel Core 2 Extreme QX6700 Intel Core i3-3250T

Essentials

Architecture codename Kentsfield Ivy Bridge
Launch date Q4'06 Q2'13
Place in performance rating not rated 1547
Processor Number QX6700 i3-3250T
Series Legacy Intel® Core™ Processors Legacy Intel® Core™ Processors
Status Discontinued Launched
Vertical segment Desktop Desktop

Performance

64 bit support
Base frequency 2.66 GHz 3.00 GHz
Bus Speed 1066 MHz FSB 5 GT/s DMI
Die size 286 mm2
Manufacturing process technology 65 nm 22 nm
Maximum core temperature 64.5°C 65.0°C
Number of cores 4 2
Transistor count 582 million
VID voltage range 0.8500V-1.500V
Number of threads 4

Compatibility

Low Halogen Options Available
Package Size 37.5mm x 37.5mm 37.5mm x 37.5mm
Sockets supported LGA775 FCLGA1155
Thermal Design Power (TDP) 130 Watt 35 Watt
Max number of CPUs in a configuration 1
Thermal Solution 2011A

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Anti-Theft technology
Intel® Identity Protection technology
Intel® Secure Key technology

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2, Intel® AVX
Intel® My WiFi technology
Intel® vPro™ Platform Eligibility

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)

Memory

Max memory channels 2
Maximum memory bandwidth 25.6 GB/s
Maximum memory size 32 GB
Supported memory types DDR3 1333/1600

Graphics

Device ID 0x152
Graphics base frequency 650 MHz
Graphics max dynamic frequency 1.05 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics Intel® HD Graphics 2500

Graphics interfaces

Number of displays supported 3

Peripherals

PCI Express revision 2.0
PCIe configurations up to 1x16, 2x8, 1x8 & 2x4

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