Intel Core 2 Extreme X6800 vs Intel Core i3-2102

Comparative analysis of Intel Core 2 Extreme X6800 and Intel Core i3-2102 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core 2 Extreme X6800

Intel Core i3-2102

Differences

Reasons to consider the Intel Core i3-2102

Around 14% higher maximum core temperature: 69.1°C vs 60.4°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
Around 15% lower typical power consumption: 65 Watt vs 75 Watt
Around 34% better performance in PassMark - Single thread mark: 1400 vs 1041
2x better performance in PassMark - CPU mark: 2029 vs 993

Specifications (specs)
Maximum core temperature	69.1°C vs 60.4°C
Manufacturing process technology	32 nm vs 65 nm
Thermal Design Power (TDP)	65 Watt vs 75 Watt
Benchmarks
PassMark - Single thread mark	1400 vs 1041
PassMark - CPU mark	2029 vs 993

Compare benchmarks

CPU 1: Intel Core 2 Extreme X6800
CPU 2: Intel Core i3-2102

PassMark - Single thread mark

CPU 1

CPU 2

1041

1400

PassMark - CPU mark

CPU 1

CPU 2

993

2029

Name	Intel Core 2 Extreme X6800	Intel Core i3-2102
PassMark - Single thread mark	1041	1400
PassMark - CPU mark	993	2029
Geekbench 4 - Single Core	1678
Geekbench 4 - Multi-Core	2644

Compare specifications (specs)

	Intel Core 2 Extreme X6800	Intel Core i3-2102
Essentials
Architecture codename	Conroe	Sandy Bridge
Launch date	Q3'06	June 2011
Place in performance rating	1722	1718
Processor Number	X6800	i3-2102
Series	Legacy Intel® Core™ Processors	Legacy Intel® Core™ Processors
Status	Discontinued	Discontinued
Vertical segment	Desktop	Desktop
Price now		$58
Value for money (0-100)		18.97
Performance
64 bit support
Base frequency	2.93 GHz	3.10 GHz
Bus Speed	1066 MHz FSB	5 GT/s DMI
Die size	143 mm2	131 mm
Manufacturing process technology	65 nm	32 nm
Maximum core temperature	60.4°C	69.1°C
Number of cores	2	2
Transistor count	291 million	504 million
VID voltage range	0.8500V-1.5V
L1 cache		64 KB (per core)
L2 cache		256 KB (per core)
L3 cache		3072 KB (shared)
Maximum frequency		3.1 GHz
Number of threads		4
Compatibility
Low Halogen Options Available
Package Size	37.5mm x 37.5mm	37.5mm x 37.5mm
Sockets supported	PLGA775	FCLGA1155
Thermal Design Power (TDP)	75 Watt	65 Watt
Max number of CPUs in a configuration		1
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Intel® Identity Protection technology
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
Flexible Display interface (FDI)
Instruction set extensions		Intel® SSE4.1, Intel® SSE4.2, Intel® AVX
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® vPro™ Platform Eligibility
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
Memory
Max memory channels		2
Maximum memory bandwidth		21 GB/s
Maximum memory size		32 GB
Supported memory types		DDR3 1066/1333
Graphics
Device ID		0x102
Graphics base frequency		850 MHz
Graphics max dynamic frequency		1.10 GHz
Graphics max frequency		1.1 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics		Intel® HD Graphics 2000
Graphics interfaces
Number of displays supported		2
Wireless Display (WiDi) support
Peripherals
Max number of PCIe lanes		16
PCI Express revision		2.0