Intel Core 2 Quad Q9550s vs Intel Pentium D 935

Comparative analysis of Intel Core 2 Quad Q9550s and Intel Pentium D 935 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core 2 Quad Q9550s

Intel Pentium D 935

Differences

Reasons to consider the Intel Core 2 Quad Q9550s

2 more cores, run more applications at once: 4 vs 2
Around 20% higher maximum core temperature: 76.3°C vs 63.4°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
9.1x more L1 cache, more data can be stored in the L1 cache for quick access later
3x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 46% lower typical power consumption: 65 Watt vs 95 Watt

Number of cores	4 vs 2
Maximum core temperature	76.3°C vs 63.4°C
Manufacturing process technology	45 nm vs 65 nm
L1 cache	256 KB vs 28 KB
L2 cache	12288 KB vs 4096 KB
Thermal Design Power (TDP)	65 Watt vs 95 Watt

Reasons to consider the Intel Pentium D 935

Around 13% higher clock speed: 3.2 GHz vs 2.83 GHz

Maximum frequency	3.2 GHz vs 2.83 GHz
Max number of CPUs in a configuration	2 vs 1

Compare benchmarks

CPU 1: Intel Core 2 Quad Q9550s
CPU 2: Intel Pentium D 935

Name	Intel Core 2 Quad Q9550s	Intel Pentium D 935
Geekbench 4 - Single Core		186
Geekbench 4 - Multi-Core		309

Compare specifications (specs)

	Intel Core 2 Quad Q9550s	Intel Pentium D 935
Essentials
Architecture codename	Yorkfield	Presler
Launch date	January 2007	January 2007
Place in performance rating	not rated	3287
Processor Number	Q9550S	935
Series	Legacy Intel® Core™ Processors	Legacy Intel® Pentium® Processor
Status	Discontinued	Discontinued
Vertical segment	Desktop	Desktop
Performance
64 bit support
Base frequency	2.83 GHz	3.20 GHz
Bus Speed	1333 MHz FSB	800 MHz FSB
Die size	214 mm2	162 mm2
L1 cache	256 KB	28 KB
L2 cache	12288 KB	4096 KB
Manufacturing process technology	45 nm	65 nm
Maximum case temperature (TCase)	76 °C
Maximum core temperature	76.3°C	63.4°C
Maximum frequency	2.83 GHz	3.2 GHz
Number of cores	4	2
Transistor count	820 million	376 million
VID voltage range	0.8500V-1.3625V	1.200V-1.3375V
Memory
Supported memory types	DDR1, DDR2, DDR3	DDR1, DDR2, DDR3
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	2
Package Size	37.5mm x 37.5mm	37.5mm x 37.5mm
Sockets supported	LGA775	PLGA775
Thermal Design Power (TDP)	65 Watt	95 Watt
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)