Intel Core 2 Solo ULV SU3500 vs Intel Xeon E5502
Comparative analysis of Intel Core 2 Solo ULV SU3500 and Intel Xeon E5502 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Core 2 Solo ULV SU3500
- Around 32% higher maximum core temperature: 100°C vs 76°C
- 6x more L2 cache, more data can be stored in the L2 cache for quick access later
- 13.3x lower typical power consumption: 5.5 Watt vs 80 Watt
| Maximum core temperature | 100°C vs 76°C |
| L2 cache | 3072 KB vs 256 KB (per core) |
| Thermal Design Power (TDP) | 5.5 Watt vs 80 Watt |
Reasons to consider the Intel Xeon E5502
- 1 more cores, run more applications at once: 2 vs 1
- Around 33% higher clock speed: 1.86 GHz vs 1.4 GHz
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
| Number of cores | 2 vs 1 |
| Maximum frequency | 1.86 GHz vs 1.4 GHz |
| L1 cache | 64 KB (per core) vs 64 KB |
| Max number of CPUs in a configuration | 2 vs 1 |
Compare benchmarks
CPU 1: Intel Core 2 Solo ULV SU3500
CPU 2: Intel Xeon E5502
| Name | Intel Core 2 Solo ULV SU3500 | Intel Xeon E5502 |
|---|---|---|
| PassMark - Single thread mark | 825 | |
| PassMark - CPU mark | 1853 |
Compare specifications (specs)
| Intel Core 2 Solo ULV SU3500 | Intel Xeon E5502 | |
|---|---|---|
Essentials |
||
| Architecture codename | Penryn | Nehalem EP |
| Launch date | March 2009 | March 2009 |
| Place in performance rating | not rated | 2497 |
| Processor Number | SU3500 | E5502 |
| Series | Legacy Intel® Core™ Processors | Legacy Intel® Xeon® Processors |
| Status | Discontinued | Launched |
| Vertical segment | Mobile | Server |
| Launch price (MSRP) | $95 | |
| Price now | $95 | |
| Value for money (0-100) | 4.27 | |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.40 GHz | 1.86 GHz |
| Bus Speed | 800 MHz FSB | 4.8 GT/s QPI |
| Die size | 107 mm2 | 263 mm |
| L1 cache | 64 KB | 64 KB (per core) |
| L2 cache | 3072 KB | 256 KB (per core) |
| Manufacturing process technology | 45 nm | 45 nm |
| Maximum core temperature | 100°C | 76°C |
| Maximum frequency | 1.4 GHz | 1.86 GHz |
| Number of cores | 1 | 2 |
| Transistor count | 410 million | 731 million |
| VID voltage range | 1.050V-1.150V | 0.75V -1.35V |
| L3 cache | 4096 KB (shared) | |
| Number of QPI Links | 2 | |
| Number of threads | 2 | |
Memory |
||
| Supported memory types | DDR1 | DDR3 800 |
| ECC memory support | ||
| Max memory channels | 3 | |
| Maximum memory bandwidth | 19.2 GB/s | |
| Maximum memory size | 144 GB | |
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | 2 |
| Package Size | 22mm x 22mm | 42.5mm x 45mm |
| Sockets supported | BGA956 | FCLGA1366 |
| Thermal Design Power (TDP) | 5.5 Watt | 80 Watt |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Intel 64 | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Idle States | ||
| Physical Address Extensions (PAE) | 40-bit | |
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||