Intel Core M-5Y70 vs Intel Core 2 Duo SP9400
Comparative analysis of Intel Core M-5Y70 and Intel Core 2 Duo SP9400 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps).
Differences
Reasons to consider the Intel Core M-5Y70
- CPU is newer: launch date 6 year(s) 0 month(s) later
- 2 more threads: 4 vs 2
- Around 8% higher clock speed: 2.60 GHz vs 2.4 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 45 nm
- 5x lower typical power consumption: 4.5 Watt vs 25 Watt
- Around 22% better performance in PassMark - Single thread mark: 1136 vs 929
- 2.2x better performance in PassMark - CPU mark: 1872 vs 863
- Around 52% better performance in Geekbench 4 - Single Core: 509 vs 335
- Around 54% better performance in Geekbench 4 - Multi-Core: 900 vs 584
| Specifications (specs) | |
| Launch date | 5 September 2014 vs 20 August 2008 |
| Number of threads | 4 vs 2 |
| Maximum frequency | 2.60 GHz vs 2.4 GHz |
| Manufacturing process technology | 14 nm vs 45 nm |
| Thermal Design Power (TDP) | 4.5 Watt vs 25 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 1136 vs 929 |
| PassMark - CPU mark | 1872 vs 863 |
| Geekbench 4 - Single Core | 509 vs 335 |
| Geekbench 4 - Multi-Core | 900 vs 584 |
Reasons to consider the Intel Core 2 Duo SP9400
- Around 11% higher maximum core temperature: 105°C vs 95°C
- 12x more L2 cache, more data can be stored in the L2 cache for quick access later
| Maximum core temperature | 105°C vs 95°C |
| L2 cache | 6134 KB vs 512 KB |
Compare benchmarks
CPU 1: Intel Core M-5Y70
CPU 2: Intel Core 2 Duo SP9400
| PassMark - Single thread mark |
|
|
||||
| PassMark - CPU mark |
|
|
||||
| Geekbench 4 - Single Core |
|
|
||||
| Geekbench 4 - Multi-Core |
|
|
| Name | Intel Core M-5Y70 | Intel Core 2 Duo SP9400 |
|---|---|---|
| PassMark - Single thread mark | 1136 | 929 |
| PassMark - CPU mark | 1872 | 863 |
| Geekbench 4 - Single Core | 509 | 335 |
| Geekbench 4 - Multi-Core | 900 | 584 |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 8.801 | |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 13.109 | |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.239 | |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 1.096 | |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 13.004 | |
| GFXBench 4.0 - Car Chase Offscreen (Frames) | 675 | |
| GFXBench 4.0 - Car Chase Offscreen (Fps) | 675 |
Compare specifications (specs)
| Intel Core M-5Y70 | Intel Core 2 Duo SP9400 | |
|---|---|---|
Essentials |
||
| Architecture codename | Broadwell | Penryn |
| Launch date | 5 September 2014 | 20 August 2008 |
| Place in performance rating | 2767 | 2774 |
| Processor Number | 5Y70 | SP9400 |
| Series | 5th Generation Intel® Core™ M Processors | Legacy Intel® Core™ Processors |
| Status | Launched | Discontinued |
| Vertical segment | Mobile | Mobile |
| Launch price (MSRP) | $284 | |
| Price now | $284 | |
| Value for money (0-100) | 1.74 | |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.10 GHz | 2.40 GHz |
| Bus Speed | 5 GT/s | 1066 MHz FSB |
| Die size | 82 mm | 107 mm2 |
| L1 cache | 128 KB | |
| L2 cache | 512 KB | 6134 KB |
| L3 cache | 4 MB | |
| Manufacturing process technology | 14 nm | 45 nm |
| Maximum core temperature | 95°C | 105°C |
| Maximum frequency | 2.60 GHz | 2.4 GHz |
| Number of cores | 2 | 2 |
| Number of threads | 4 | 2 |
| Transistor count | 1300 Million | 410 million |
| Front-side bus (FSB) | 1066 MHz | |
Memory |
||
| Max memory channels | 2 | |
| Maximum memory bandwidth | 25.6 GB/s | |
| Maximum memory size | 16 GB | |
| Supported memory types | DDR3L 1333/1600, LPDDR3 1333/1600 | |
Graphics |
||
| Device ID | 0x161E | |
| Graphics base frequency | 100 MHz | |
| Graphics max dynamic frequency | 850 MHz | |
| Graphics max frequency | 850 MHz | |
| Intel® Clear Video HD technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Max video memory | 16 GB | |
| Processor graphics | Intel® HD Graphics 5300 | |
Graphics interfaces |
||
| DisplayPort | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 3 | |
| Wireless Display (WiDi) support | ||
Graphics image quality |
||
| Max resolution over DisplayPort | 2560x1600@60Hz | |
| Max resolution over HDMI 1.4 | 2560x1600@60Hz | |
Graphics API support |
||
| DirectX | 11.2/12 | |
| OpenGL | 4.3 | |
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | |
| Package Size | 30mm x 16.5mm x 1.05mm | 22mm x 22mm |
| Sockets supported | BGA | BGA956 |
| Thermal Design Power (TDP) | 4.5 Watt | 25 Watt |
Peripherals |
||
| Max number of PCIe lanes | 12 | |
| PCI Express revision | 2.0 | |
| PCIe configurations | 4x1, 2x4 | |
Security & Reliability |
||
| Anti-Theft technology | ||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| Flexible Display interface (FDI) | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
| Intel 64 | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Intel® Fast Memory Access | ||
| Intel® Flex Memory Access | ||
| Intel® Hyper-Threading technology | ||
| Intel® Smart Response technology | ||
| Intel® Stable Image Platform Program (SIPP) | ||
| Intel® TSX-NI | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
| FSB parity | ||
| Intel® Demand Based Switching | ||
Virtualization |
||
| AMD Virtualization (AMD-V™) | ||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
