Intel Core i3-10100Y vs Intel Core i7-8809G
Comparative analysis of Intel Core i3-10100Y and Intel Core i7-8809G processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the Intel Core i3-10100Y
- 20x lower typical power consumption: 5 Watt vs 100 Watt
Thermal Design Power (TDP) | 5 Watt vs 100 Watt |
Reasons to consider the Intel Core i7-8809G
- Around 8% higher clock speed: 4.20 GHz vs 3.90 GHz
- 4x more maximum memory size: 64 GB vs 16 GB
- Around 48% better performance in PassMark - Single thread mark: 2384 vs 1616
- 3x better performance in PassMark - CPU mark: 8543 vs 2873
Specifications (specs) | |
Maximum frequency | 4.20 GHz vs 3.90 GHz |
Maximum memory size | 64 GB vs 16 GB |
Benchmarks | |
PassMark - Single thread mark | 2384 vs 1616 |
PassMark - CPU mark | 8543 vs 2873 |
Compare benchmarks
CPU 1: Intel Core i3-10100Y
CPU 2: Intel Core i7-8809G
PassMark - Single thread mark |
|
|
||||
PassMark - CPU mark |
|
|
Name | Intel Core i3-10100Y | Intel Core i7-8809G |
---|---|---|
PassMark - Single thread mark | 1616 | 2384 |
PassMark - CPU mark | 2873 | 8543 |
Geekbench 4 - Single Core | 1093 | |
Geekbench 4 - Multi-Core | 4285 | |
3DMark Fire Strike - Physics Score | 0 |
Compare specifications (specs)
Intel Core i3-10100Y | Intel Core i7-8809G | |
---|---|---|
Essentials |
||
Architecture codename | Amber Lake Y | Kaby Lake G |
Launch date | Q1'21 | 10 January 2018 |
Place in performance rating | 1591 | 1613 |
Processor Number | i3-10100Y | i7-8809G |
Series | 10th Generation Intel Core i3 Processors | 8th Generation Intel® Core™ i7 Processors |
Status | Launched | Announced |
Vertical segment | Mobile | Mobile |
Performance |
||
64 bit support | ||
Base frequency | 1.30 GHz | 3.10 GHz |
Bus Speed | 4 GT/s | 8 GT/s DMI |
Manufacturing process technology | 14 nm | 14 nm |
Maximum core temperature | 100°C | 100°C |
Maximum frequency | 3.90 GHz | 4.20 GHz |
L1 cache | 256 KB | |
L2 cache | 1 MB | |
L3 cache | 8 MB | |
Maximum case temperature (TCase) | 72 °C | |
Number of cores | 4 | |
Number of threads | 8 | |
Memory |
||
Max memory channels | 2 | 2 |
Maximum memory bandwidth | 33.3 GB/s | 37.5 GB/s |
Maximum memory size | 16 GB | 64 GB |
Supported memory types | LPDDR3-1866, DDR3L-1600 | DDR4-2400 |
Graphics |
||
Device ID | 0x591C | |
Execution Units | 24 | |
Graphics base frequency | 300 MHz | 350 MHz |
Graphics max dynamic frequency | 1.00 GHz | 1.10 GHz |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® Quick Sync Video | ||
Max video memory | 16 GB | 64 GB |
Processor graphics | Intel UHD Graphics 615 | Intel® HD Graphics 630 |
Intel® InTru™ 3D technology | ||
Graphics interfaces |
||
DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | 3 |
Graphics image quality |
||
4K resolution support | ||
Max resolution over DisplayPort | 3840x2160@60Hz | 4096 x 2160 @60Hz |
Max resolution over eDP | 3840x2160@60Hz | 4096 x 2160 @60Hz |
Max resolution over HDMI 1.4 | 4096 x 2160 @30Hz | |
Graphics API support |
||
DirectX | 12 | 12 |
OpenGL | 4.5 | 4.4 |
Compatibility |
||
Configurable TDP-down | 3.5 Watt | |
Configurable TDP-down Frequency | 600 MHz | |
Configurable TDP-up | 7 Watt | |
Configurable TDP-up Frequency | 1.60 GHz | |
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 20mm X 16.5mm | 31mm x 58.5mm |
Thermal Design Power (TDP) | 5 Watt | 100 Watt |
Low Halogen Options Available | ||
Sockets supported | BGA2270 | |
Peripherals |
||
Max number of PCIe lanes | 10 | 8 |
PCI Express revision | 3.0 | 3.0 |
PCIe configurations | 1x4, 2x2, 1x2+2x1 and 4x1 | Up to 1x8, 2x4 |
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Advanced Technologies |
||
Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® Turbo Boost technology | ||
Speed Shift technology | ||
Thermal Monitoring | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® My WiFi technology | ||
Intel® Smart Response technology | ||
Intel® TSX-NI | ||
Intel® vPro™ Platform Eligibility | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
AMD Virtualization (AMD-V™) |