Architektur Codename |
Amber Lake Y |
Kaby Lake G |
Startdatum |
Q1'21 |
10 January 2018 |
Platz in der Leistungsbewertung |
1591 |
1613 |
Processor Number |
i3-10100Y |
i7-8809G |
Serie |
10th Generation Intel Core i3 Processors |
8th Generation Intel® Core™ i7 Processors |
Status |
Launched |
Announced |
Vertikales Segment |
Mobile |
Mobile |
64-Bit-Unterstützung |
|
|
Base frequency |
1.30 GHz |
3.10 GHz |
Bus Speed |
4 GT/s |
8 GT/s DMI |
Fertigungsprozesstechnik |
14 nm |
14 nm |
Maximale Kerntemperatur |
100°C |
100°C |
Maximale Frequenz |
3.90 GHz |
4.20 GHz |
L1 Cache |
|
256 KB |
L2 Cache |
|
1 MB |
L3 Cache |
|
8 MB |
Maximale Gehäusetemperatur (TCase) |
|
72 °C |
Anzahl der Adern |
|
4 |
Anzahl der Gewinde |
|
8 |
Maximale Speicherkanäle |
2 |
2 |
Maximale Speicherbandbreite |
33.3 GB/s |
37.5 GB/s |
Maximale Speichergröße |
16 GB |
64 GB |
Unterstützte Speichertypen |
LPDDR3-1866, DDR3L-1600 |
DDR4-2400 |
Device ID |
0x591C |
|
Ausführungseinheiten |
24 |
|
Graphics base frequency |
300 MHz |
350 MHz |
Graphics max dynamic frequency |
1.00 GHz |
1.10 GHz |
Intel® Clear Video HD Technologie |
|
|
Intel® Clear Video Technologie |
|
|
Intel® Quick Sync Video |
|
|
Maximaler Videospeicher |
16 GB |
64 GB |
Prozessorgrafiken |
Intel UHD Graphics 615 |
Intel® HD Graphics 630 |
Intel® InTru™ 3D-Technologie |
|
|
DisplayPort |
|
|
DVI |
|
|
eDP |
|
|
HDMI |
|
|
Anzahl der unterstützten Anzeigen |
3 |
3 |
Unterstützung von 4K-Auflösungen |
|
|
Maximale Auflösung über DisplayPort |
3840x2160@60Hz |
4096 x 2160 @60Hz |
Maximale Auflösung über eDP |
3840x2160@60Hz |
4096 x 2160 @60Hz |
Maximale Auflösung über HDMI 1.4 |
|
4096 x 2160 @30Hz |
DirectX |
12 |
12 |
OpenGL |
4.5 |
4.4 |
Configurable TDP-down |
3.5 Watt |
|
Configurable TDP-down Frequency |
600 MHz |
|
Configurable TDP-up |
7 Watt |
|
Configurable TDP-up Frequency |
1.60 GHz |
|
Maximale Anzahl von CPUs in einer Konfiguration |
1 |
1 |
Package Size |
20mm X 16.5mm |
31mm x 58.5mm |
Thermische Designleistung (TDP) |
5 Watt |
100 Watt |
Low Halogen Options Available |
|
|
Unterstützte Sockel |
|
BGA2270 |
Maximale Anzahl von PCIe-Strecken |
10 |
8 |
PCI Express Revision |
3.0 |
3.0 |
PCIe configurations |
1x4, 2x2, 1x2+2x1 and 4x1 |
Up to 1x8, 2x4 |
Execute Disable Bit (EDB) |
|
|
Intel® Identity Protection Technologie |
|
|
Intel® Memory Protection Extensions (Intel® MPX) |
|
|
Intel® OS Guard |
|
|
Intel® Secure Key Technologie |
|
|
Intel® Trusted Execution Technologie (TXT) |
|
|
Intel® Software Guard Extensions (Intel® SGX) |
|
|
Enhanced Intel SpeedStep® Technologie |
|
|
Idle States |
|
|
Befehlssatzerweiterungen |
Intel SSE4.1, Intel SSE4.2, Intel AVX2 |
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel 64 |
|
|
Intel® AES New Instructions |
|
|
Intel® Flex Memory Access |
|
|
Intel® Hyper-Threading Technologie |
|
|
Intel® Stable Image Platform Program (SIPP) |
|
|
Intel® Turbo Boost Technologie |
|
|
Speed Shift technology |
|
|
Thermal Monitoring |
|
|
Intel® Advanced Vector Extensions (AVX) |
|
|
Intel® My WiFi Technologie |
|
|
Intel® Smart Response Technologie |
|
|
Intel® TSX-NI |
|
|
Intel® vPro™ Platform Eligibility |
|
|
Intel® Virtualization Technology (VT-x) |
|
|
Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
Intel® VT-x with Extended Page Tables (EPT) |
|
|
AMD Virtualization (AMD-V™) |
|
|