Intel Core i3-2100 vs AMD Sempron 3000+
Comparative analysis of Intel Core i3-2100 and AMD Sempron 3000+ processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Core i3-2100
- CPU is newer: launch date 4 year(s) 9 month(s) later
- 1 more cores, run more applications at once: 2 vs 1
- Around 94% higher clock speed: 3.1 GHz vs 1.6 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 90 nm
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- 2.7x better performance in PassMark - Single thread mark: 1419 vs 530
- 6.2x better performance in PassMark - CPU mark: 1857 vs 299
Specifications (specs) | |
Launch date | February 2011 vs May 2006 |
Number of cores | 2 vs 1 |
Maximum frequency | 3.1 GHz vs 1.6 GHz |
Manufacturing process technology | 32 nm vs 90 nm |
L2 cache | 256 KB (per core) vs 256 KB |
Benchmarks | |
PassMark - Single thread mark | 1419 vs 530 |
PassMark - CPU mark | 1857 vs 299 |
Reasons to consider the AMD Sempron 3000+
- Around 5% lower typical power consumption: 62 Watt vs 65 Watt
Thermal Design Power (TDP) | 62 Watt vs 65 Watt |
Compare benchmarks
CPU 1: Intel Core i3-2100
CPU 2: AMD Sempron 3000+
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Core i3-2100 | AMD Sempron 3000+ |
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PassMark - Single thread mark | 1419 | 530 |
PassMark - CPU mark | 1857 | 299 |
Geekbench 4 - Single Core | 544 | |
Geekbench 4 - Multi-Core | 1208 | |
3DMark Fire Strike - Physics Score | 0 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 2.043 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 34.598 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.227 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 0.938 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 2.215 |
Compare specifications (specs)
Intel Core i3-2100 | AMD Sempron 3000+ | |
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Essentials |
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Architecture codename | Sandy Bridge | Manila |
Launch date | February 2011 | May 2006 |
Launch price (MSRP) | $73 | $50 |
Place in performance rating | 2908 | 2952 |
Price now | $59.99 | $49.95 |
Processor Number | i3-2100 | |
Series | Legacy Intel® Core™ Processors | |
Status | Discontinued | |
Value for money (0-100) | 18.10 | 2.41 |
Vertical segment | Desktop | Desktop |
Performance |
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64 bit support | ||
Base frequency | 3.10 GHz | |
Bus Speed | 5 GT/s DMI | |
Die size | 131 mm | 103 mm |
L1 cache | 64 KB (per core) | 128 KB |
L2 cache | 256 KB (per core) | 256 KB |
L3 cache | 3072 KB (shared) | |
Manufacturing process technology | 32 nm | 90 nm |
Maximum core temperature | 69.1°C | |
Maximum frequency | 3.1 GHz | 1.6 GHz |
Number of cores | 2 | 1 |
Number of threads | 4 | |
Transistor count | 504 million | 81 million |
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 21 GB/s | |
Maximum memory size | 32 GB | |
Supported memory types | DDR3 1066/1333 | |
Graphics |
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Device ID | 0x102 | |
Graphics base frequency | 850 MHz | |
Graphics max dynamic frequency | 1.10 GHz | |
Graphics max frequency | 1.1 GHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel® HD Graphics 2000 | |
Graphics interfaces |
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Number of displays supported | 2 | |
Wireless Display (WiDi) support | ||
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mm x 37.5mm | |
Sockets supported | FCLGA1155 | AM2 |
Thermal Design Power (TDP) | 65 Watt | 62 Watt |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 2.0 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |