Intel Core i3-2100 vs Intel Core 2 Duo E6400

Comparative analysis of Intel Core i3-2100 and Intel Core 2 Duo E6400 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

Intel Core i3-2100

Intel Core 2 Duo E6400

Differences

Reasons to consider the Intel Core i3-2100

CPU is newer: launch date 4 year(s) 7 month(s) later
Around 46% higher clock speed: 3.1 GHz vs 2.13 GHz
Around 13% higher maximum core temperature: 69.1°C vs 61.4°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
2x more L1 cache, more data can be stored in the L1 cache for quick access later
Around 72% better performance in PassMark - Single thread mark: 1421 vs 825
2.4x better performance in PassMark - CPU mark: 1858 vs 780
2.2x better performance in Geekbench 4 - Single Core: 544 vs 244
2.9x better performance in Geekbench 4 - Multi-Core: 1208 vs 413

Specifications (specs)
Launch date	February 2011 vs July 2006
Maximum frequency	3.1 GHz vs 2.13 GHz
Maximum core temperature	69.1°C vs 61.4°C
Manufacturing process technology	32 nm vs 65 nm
L1 cache	64 KB (per core) vs 64 KB
Benchmarks
PassMark - Single thread mark	1421 vs 825
PassMark - CPU mark	1858 vs 780
Geekbench 4 - Single Core	544 vs 244
Geekbench 4 - Multi-Core	1208 vs 413

Reasons to consider the Intel Core 2 Duo E6400

4x more L2 cache, more data can be stored in the L2 cache for quick access later

L2 cache	2048 KB vs 256 KB (per core)

Compare benchmarks

CPU 1: Intel Core i3-2100
CPU 2: Intel Core 2 Duo E6400

PassMark - Single thread mark

CPU 1

CPU 2

1421

825

PassMark - CPU mark

CPU 1

CPU 2

1858

780

Geekbench 4 - Single Core

CPU 1

CPU 2

544

244

Geekbench 4 - Multi-Core

CPU 1

CPU 2

1208

413

Name	Intel Core i3-2100	Intel Core 2 Duo E6400
PassMark - Single thread mark	1421	825
PassMark - CPU mark	1858	780
Geekbench 4 - Single Core	544	244
Geekbench 4 - Multi-Core	1208	413
3DMark Fire Strike - Physics Score	0
CompuBench 1.5 Desktop - Face Detection (mPixels/s)	2.043
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)	34.598
CompuBench 1.5 Desktop - T-Rex (Frames/s)	0.227
CompuBench 1.5 Desktop - Video Composition (Frames/s)	0.938
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)	2.215

Compare specifications (specs)

	Intel Core i3-2100	Intel Core 2 Duo E6400
Essentials
Architecture codename	Sandy Bridge	Conroe
Launch date	February 2011	July 2006
Launch price (MSRP)	$73
Place in performance rating	2908	2913
Price now	$59.99	$19.95
Processor Number	i3-2100	E6400
Series	Legacy Intel® Core™ Processors	Legacy Intel® Core™ Processors
Status	Discontinued	Discontinued
Value for money (0-100)	18.10	19.03
Vertical segment	Desktop	Desktop
Performance
64 bit support
Base frequency	3.10 GHz	2.13 GHz
Bus Speed	5 GT/s DMI	1066 MHz FSB
Die size	131 mm	111 mm2
L1 cache	64 KB (per core)	64 KB
L2 cache	256 KB (per core)	2048 KB
L3 cache	3072 KB (shared)
Manufacturing process technology	32 nm	65 nm
Maximum core temperature	69.1°C	61.4°C
Maximum frequency	3.1 GHz	2.13 GHz
Number of cores	2	2
Number of threads	4
Transistor count	504 million	167 million
VID voltage range		0.8500V-1.5V
Memory
Max memory channels	2
Maximum memory bandwidth	21 GB/s
Maximum memory size	32 GB
Supported memory types	DDR3 1066/1333	DDR1, DDR2, DDR3
Graphics
Device ID	0x102
Graphics base frequency	850 MHz
Graphics max dynamic frequency	1.10 GHz
Graphics max frequency	1.1 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel® HD Graphics 2000
Graphics interfaces
Number of displays supported	2
Wireless Display (WiDi) support
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	37.5mm x 37.5mm	37.5mm x 37.5mm
Sockets supported	FCLGA1155	PLGA775, LGA775
Thermal Design Power (TDP)	65 Watt	65 Watt
Scenario Design Power (SDP)		0 W
Peripherals
Max number of PCIe lanes	16
PCI Express revision	2.0
Security & Reliability
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX
Intel 64
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
FSB parity
Intel® Demand Based Switching
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)