Intel Core i3-2340UE vs AMD Phenom II X4 N970
Comparative analysis of Intel Core i3-2340UE and AMD Phenom II X4 N970 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core i3-2340UE
- CPU is newer: launch date 5 month(s) later
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
- 2.1x lower typical power consumption: 17 Watt vs 35 Watt
Launch date | June 2011 vs 16 December 2010 |
Manufacturing process technology | 32 nm vs 45 nm |
Thermal Design Power (TDP) | 17 Watt vs 35 Watt |
Reasons to consider the AMD Phenom II X4 N970
- 2 more cores, run more applications at once: 4 vs 2
- Around 69% higher clock speed: 2.2 GHz vs 1.3 GHz
- 4x more L1 cache, more data can be stored in the L1 cache for quick access later
- 4x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 46% better performance in PassMark - Single thread mark: 904 vs 620
- Around 73% better performance in PassMark - CPU mark: 1687 vs 976
Specifications (specs) | |
Number of cores | 4 vs 2 |
Maximum frequency | 2.2 GHz vs 1.3 GHz |
L1 cache | 512 KB vs 64 KB (per core) |
L2 cache | 2 MB vs 256 KB (per core) |
Benchmarks | |
PassMark - Single thread mark | 904 vs 620 |
PassMark - CPU mark | 1687 vs 976 |
Compare benchmarks
CPU 1: Intel Core i3-2340UE
CPU 2: AMD Phenom II X4 N970
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Core i3-2340UE | AMD Phenom II X4 N970 |
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PassMark - Single thread mark | 620 | 904 |
PassMark - CPU mark | 976 | 1687 |
Geekbench 4 - Single Core | 256 | |
Geekbench 4 - Multi-Core | 930 |
Compare specifications (specs)
Intel Core i3-2340UE | AMD Phenom II X4 N970 | |
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Essentials |
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Architecture codename | Sandy Bridge | Champlain |
Launch date | June 2011 | 16 December 2010 |
Place in performance rating | 2788 | 2781 |
Processor Number | i3-2340UE | |
Series | Legacy Intel® Core™ Processors | AMD Phenom II Quad-Core Mobile Processors |
Status | Launched | |
Vertical segment | Embedded | Laptop |
Family | AMD Phenom | |
OPN Tray | HMN970DCR42GM | |
Performance |
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64 bit support | ||
Base frequency | 1.30 GHz | 2.2 GHz |
Die size | 149 mm | |
L1 cache | 64 KB (per core) | 512 KB |
L2 cache | 256 KB (per core) | 2 MB |
L3 cache | 3072 KB (shared) | |
Manufacturing process technology | 32 nm | 45 nm |
Maximum core temperature | 100C (BGA) | 100°C |
Maximum frequency | 1.3 GHz | 2.2 GHz |
Number of cores | 2 | 4 |
Number of threads | 4 | 4 |
Transistor count | 624 million | |
Front-side bus (FSB) | 3600 MHz | |
Unlocked | ||
Memory |
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ECC memory support | ||
Max memory channels | 2 | |
Maximum memory bandwidth | 21.3 GB/s | |
Maximum memory size | 16.6 GB | |
Supported memory types | DDR3 1066/1333 | DDR3 |
Graphics |
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Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 800 MHz | |
Graphics max frequency | 800 MHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel® HD Graphics 3000 | |
Graphics interfaces |
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CRT | ||
DisplayPort | ||
eDP | ||
HDMI | ||
Number of displays supported | 2 | |
SDVO | ||
Wireless Display (WiDi) support | ||
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | 31mm x 24mm (BGA1023) | |
Sockets supported | FCBGA1023 | S1 |
Thermal Design Power (TDP) | 17 Watt | 35 Watt |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 2.0 | |
PCIe configurations | 1x16, 2x8, 1x8 2x4 | |
Security & Reliability |
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Anti-Theft technology | ||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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4G WiMAX Wireless | ||
Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® AVX | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® My WiFi technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |